NVIDIA CEO Jensen Huang stated that the Memory chip market represents a completely unserved market

Since the fourth quarter of last year, OEMs have generally implemented substantial month-on-month price increases for NAND resources supplied to downstream Memory manufacturers. Price increases in the channel market resource trade have been even more dramatic. Except for some Memory manufacturers that have formed strategic partnerships with OEMs, others find it relatively difficult to stock up due to excessively high trade-side prices. The upward trend for both NAND and DRAM resources, including lower-end resources, continues. Channel manufacturers are becoming more cautious about pricing and allocation of finished products. SSDs and finished DDR modules are primarily allocated to support core customers such as PC OEMs, with their prices being continuously adjusted upward in line with rising costs. Other customers must accept higher quotations.

SK hynix Inc. announced that it will open a customer exhibition booth at Venetian Expo and showcase its next-generation AI Memory solutions at CES 2026, in Las Vegas from January 6 to 9 (local time).

Netlist claims that Samsung Electronics’ core Memory products, including High Bandwidth Memory (HBM) and DDR5, have infringed on its technology patents. The company has requested the ITC to issue exclusion orders and cease-and-desist orders to prevent the import of the allegedly infringing products into the United States.

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Approaching the New Year's Day holiday, Prices of finished Memory products remained high and consolidated this week.On the upstream resource side, prices of some Flash Wafers rose, with the 512Gb TLC increasing by 9.09% to $12.00, while other prices remained unchanged.

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Aside from embedded eMMC and UFS products, whose prices have been adjusted upward in line with significant resource cost increases, the spot Memory market remained largely stable this week.

SK hynix Inc.announced that it has become the first in the industry to complete the Intel Data Center Certified process to apply 256GB DDR5 RDIMM1—a high capacity server module based on 32Gb fifth-generation 10nm-class (1b) DRAM— to Intel Xeon 6 platform.

Samsung and Samsung Advanced Institute of Technology on Tuesday unveiled its technology to make DRAM smaller than 10-nanometer (nm).

Although the liquidation behavior of individual traders last week led to a slight loosening of the prices of relevant resources, a few days later, the prices of resources in the trading sector were quickly pushed up again. Judging from the NAND resources released by Memory manufacturers recently, the prices of Flash Wafers with a capacity of 512Gb and above have reached two to three times that of the same period in the third quarter. Short - term and individual trading behaviors have failed to change the upward - breaking trend of resource prices.

Since the fourth quarter, due to the significant price increase of upstream resources and the overall limited supply, suppliers, apart from giving priority to meeting the supply of core customers, have been strictly controlling the order - taking volume for mass customers in a price - oriented manner.