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CFM Report - Memory Industry Monthly Update - May 2026
2025-2026 Global Memory Market Trend White Paper

2025-2026 Global Memory Market Trend White Paper

Memory Spot Market Industrial SSDs Steady with Moderate Gains; UDIMM,SODIMMs,and Channel SSDs Continue to See Downward Revisions

Memory Spot Market Industrial SSDs Steady with Moderate Gains; UDIMM,SODIMMs,and Channel SSDs Continue to See Downward Revisions

Samsung: Memory Revenue Contribution Exceeds 50% for First Time, HBM4 Expected to Account for Over Half of Total HBM Sales from Q3

Samsung: Memory Revenue Contribution Exceeds 50% for First Time, HBM4 Expected to Account for Over Half of Total HBM Sales from Q3

SK Hynix Unveils 1100 Trillion Won Medium- to Long-Term Investment Strategy

20 hours ago Enterprise News

Samsung Unveils Massive 2,655 Trillion Won Domestic Investment Plan

21 hours ago Industry News

Applied Materials Unveils Series of 3D Manufacturing Equipment for AI Chips, Targeting HBM Stacking Processes

21 hours ago Industry News

Lenovo IDG President Luca: Adequate Supply Secured, but Cost Hikes Unavoidable

3 days ago Industry News

SK Hynix Plans to Build New NAND Fab in Cheongju

3 days ago Industry News

Memory Giants Spark "U.S. Listing Wave": SK Hynix Finalizes Ticker to Rush Nasdaq, Kioxia Announces ADR Issuance Timeline

3 days ago Industry News

Micron Projects $50 Billion Revenue for June–August, 16 SCAs Lock $100 Billion Revenue, Supply Shortage to Persist Beyond 2027

5 days ago Financial Analys

Samsung Reportedly Halts 8-Hi HBM3E Production, Shifts Capacity to HBM4

5 days ago Industry News

Samsung NAND Roadmap Leaked: 560+ Layers by 2030, Racing Toward the 1,000-Layer Flash Era

5 days ago Industry News

NAND Prices Decline at the Trading End Amid Cash-Out Pressures, with slight price reductions for 512Gb TLC and 1Tb QLC wafers

6 days ago Weekly Review
NAND Prices Decline at the Trading End Amid Cash-Out Pressures, with slight price reductions for 512Gb TLC and 1Tb QLC wafers

SPHBM4 Standard Approved, Breaking the Bottleneck of High HBM Packaging Costs

6 days ago Industry News

Samsung Unveils Industry's Fastest UFS 5.0, Mass Production Starts from Q4

6 days ago Enterprise News

Micron and Anthropic Announce Strategic Agreement to Scale Next-Generation AI Infrastructure

6 days ago Enterprise News

SK hynix shifts to commodity DRAM as margins top HBM, opening Samsung HBM chance

6 days ago Industry News

Samsung Convenes Global Strategy Meeting: Focuses on HBM Supply Strategy and Long-Term Agreements

2026-06-22 10:44 (UTC+0) Industry News

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Newsflash

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21 hours ago
Samsung Unveils Its 2,655 Trillion Won Domestic Investment Plan in South Korea
21 hours ago
ASICLAND Announces Approx. $20.7 Million Cooperative Design Agreement with SK hynix for Next-Gen eSSD Controllers
21 hours ago
Applied Materials Unveils Series of 3D Manufacturing Equipment for AI Chips, Targeting HBM Stacking Processes
21 hours ago
Apple Said to Be Seeking U.S. Government Approval to Procure Chinese Memory Chips
21 hours ago
Samsung's Yongin Campus Construction Plans Reportedly Unchanged, Target Remains to Break Ground by Year-End
3 days ago
Lenovo IDG President Luca: Adequate Supply Secured, but Cost Hikes Unavoidable
3 days ago
TWSC Launches TC301 In-Car Flash Drive, Built with TLC NAND Flash
3 days ago
Samsung Group Reported to Announce 1,000 Trillion Won Decade-Long Investment Plan
3 days ago
Apple Raises Prices on iPad and Mac Series, iPhone Remains Unchanged
3 days ago
Kioxia Responds to Earthquake in Northeastern Japan

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SK Hynix Unveils 1100 Trillion Won Medium- to Long-Term Investment Strategy

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