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CFMS | MemoryS
【CFM Research】Memory Prices to Rise Further in the Second Half of the Year
Memory Spot Market Industrial SSDs Steady with Moderate Gains; UDIMM,SODIMMs,and Channel SSDs Continue to See Downward Revisions
Samsung: Memory Revenue Contribution Exceeds 50% for First Time, HBM4 Expected to Account for Over Half of Total HBM Sales from Q3
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Weekly Review
SK hynix Presents 'New Spectrum' for AI Infrastructure
2026-09-18 09:38 (UTC+0)
Enterprise News
Micron Unveils the World's First Ultra-Dense Module for Next-Generation Servers, Volume Production Expected in 2H2027
2026-09-16 09:35 (UTC+0)
Enterprise News
Samsung Electronics Unveils V10 BV-NAND with Over 400 Layers and I/O Speeds Exceeding 4.8 Gbps
2026-09-01 10:02 (UTC+0)
Enterprise News
Kioxia to Expand 3D Flash Memory Production Capacity with the New Fab3 at Kitakami Plant
2026-08-27 10:19 (UTC+0)
Enterprise News
Sandisk Introduces SANDISK NAS SSDs, High-Endurance Storage for Prosumers and Small Businesses
2026-08-21 10:04 (UTC+0)
Enterprise News
SK hynix Invests 54 Trillion Won in Yongin Y2 and Cheongju M17 to Secure Mid-to-Long-Term Production Base for AI Memory Demand
2026-08-07 08:23 (UTC+0)
Enterprise News
Samsung Unveils Industry's First zHBM Concept Model and 400+ Layer V10 NAND, Defining Next-Gen 3D Memory
2026-08-05 10:29 (UTC+0)
Enterprise News
New 3D Flash Memory Technology from Kioxia and Sandisk Achieves Industry’s Highest Bit Density for QLC NAND
2026-08-05 09:21 (UTC+0)
Enterprise News
SK hynix Unveils First HBF Standard Specifications with Sandisk
2026-08-04 03:04 (UTC+0)
Enterprise News
Kioxia Commences Sample Shipments of 9th-Generation BiCS FLASH™ 1Tb TLC Devices
2026-07-30 10:25 (UTC+0)
Enterprise News
SK Group and NVIDIA Team Up in Mega $500 Billion Partnership
2026-07-27 09:56 (UTC+0)
Enterprise News
Samsung Electronics and Broadcom Expand Strategic Collaboration Across Memory and Foundry Technologies
2026-07-27 09:29 (UTC+0)
Enterprise News
SK Hynix Increases Investment in Cheongju P&T7 Project to Meet Surging AI Memory Demand
2026-07-22 10:31 (UTC+0)
Enterprise News
Micron Strengthens Automotive Ecosystem Supply Through SCAs with Seven Companies Including Qualcomm
2026-07-17 07:15 (UTC+0)
Enterprise News
Maxio Technology: H1 Net Profit Exceeds RMB 500 Million; Q2 Net Profit Surges Over 57 Times QoQ
2026-07-15 09:32 (UTC+0)
Enterprise News
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3 hours ago
Nextorage Sub-Brand N/U Releases First Three Products
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TSMC 2nm Wafer Monthly Capacity Reportedly Expected to Reach 120,000 by Year-End
3 hours ago
Nanya Technology Accused of Infringing DRAM Patents Originally Owned by Intel
3 hours ago
ByteDance Subsidiary Reportedly Obtained Nvidia B200 GPUs Through Nscale
4 days ago
Samsung Completes 16GB LPDDR6 Validation on Snapdragon 8 Elite Extreme Gen 6, Achieving 10.7Gbps I/O Speed
4 days ago
Team Group Maintains View That Supply Could Tighten Further in H1 2027
4 days ago
YMTC Wins 3D NAND Patent Battle in Germany; Micron-Related Infringing Products Banned from Sale
4 days ago
BIWIN Plans 4.5 Billion Yuan Investment for Phase III of Wafer-Level Advanced Packaging and Testing Project
4 days ago
Synopsys and TSMC Deepen Partnership to Accelerate Advanced AI Chip Design
2026-09-18 09:58 (UTC+0)
Samsung Said to Launch Galaxy Z TriFold2 Ahead of Schedule
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US ITC Officially Institutes Section 337 Investigation into DRAM Devices and Downstream Products (III)
Notice of 2026 Mid-Autumn Festival Holiday
YMTC Wins 3D NAND Patent Battle in Germany; Micron-Related Infringing Products Banned from Sale
Holiday Looms: Memory Spot Market Stalls as Price Cuts Fail to Spark Demand
Solidigm Considers Building First U.S. NAND Flash Production Base Amid Surging AI Demand
Huawei AI Chips Accelerate: Ascend 960 Series to Launch Early with Doubled Performance
Shifting to a “Dual-Track” Model? Reports Indicate Samsung Electronics’ HBM Base Die Supply Strategy is Changing