CFM has updated the domain of its english website from
en.chinaflashmarket.com
to
www.memorymarket.com
, Please be informed.
Mobile Website
About Us
|
Contact
|
中文版
Menu
Close
Home
Price Center
Add Cost Price
Weekly Review
Market News
Newsflash
Research Report
Industry Chain
CFMS | MemoryS
【CFM Research】Memory Prices to Rise Further in the Second Half of the Year
Memory Spot Market Industrial SSDs Steady with Moderate Gains; UDIMM,SODIMMs,and Channel SSDs Continue to See Downward Revisions
Samsung: Memory Revenue Contribution Exceeds 50% for First Time, HBM4 Expected to Account for Over Half of Total HBM Sales from Q3
Latest News
Industry News
Financial Analys
Technical
Enterprise News
Weekly Review
AI Demand Drives TSMC to Accelerate Capacity Expansion: Five 2nm Fabs to Ramp Up This Year, Wafer Capacity Expected to Reach 120,000 by Year-End
3 hours ago
Industry News
US ITC Officially Institutes Section 337 Investigation into DRAM Devices and Downstream Products (III)
4 days ago
Industry News
Notice of 2026 Mid-Autumn Festival Holiday
4 days ago
Industry News
YMTC Wins 3D NAND Patent Battle in Germany; Micron-Related Infringing Products Banned from Sale
4 days ago
Industry News
Solidigm Considers Building First U.S. NAND Flash Production Base Amid Surging AI Demand
2026-09-20 08:32 (UTC+0)
Industry News
Huawei AI Chips Accelerate: Ascend 960 Series to Launch Early with Doubled Performance
2026-09-17 10:31 (UTC+0)
Industry News
Micron's First Assembly and Test Plant in India Set for Ramp-Up: Chip Capacity to Reach Hundreds of Millions of Units in 2027
2026-09-17 09:34 (UTC+0)
Industry News
Nebius Said to Raise Prices for its On-demand Compute Resources Starting October
2026-09-17 09:32 (UTC+0)
Industry News
Shifting to a “Dual-Track” Model? Reports Indicate Samsung Electronics’ HBM Base Die Supply Strategy is Changing
2026-09-16 09:50 (UTC+0)
Industry News
Samsung Shifts DDR5/SSD Production to Outsourcing, Focuses In-House Capacity on HBM
2026-09-16 09:43 (UTC+0)
Industry News
Intel Lip-Bu Tan Warns AI-fueled Memory Crunch to Deepen Next Year as Memory Prices Soar
2026-09-16 09:36 (UTC+0)
Industry News
Samsung Said to Consider Raising Galaxy S26 Prices in South Korea Next Month
2026-09-14 09:24 (UTC+0)
Industry News
CXMT Reportedly Launches Equipment Tender for New Shanghai Fab, Long-Term Total Capacity Expected to Reach 600,000 Wafers Per Month
2026-09-11 10:28 (UTC+0)
Industry News
DeepSeek V4.1 Flash Officially Released, Reducing Demand for HBM and SSDs
2026-09-11 09:44 (UTC+0)
Industry News
MediaTek's August Revenue Hits New High Again, Q3 Highly Likely to Exceed Targets
2026-09-11 09:42 (UTC+0)
Industry News
Price Center
View All
Flash Wafer
DDR
RDIMM
UDIMM
SODIMM
Channel SSD
OEM SSD
LPDDR
eMMC
eMCP
UFS
uMCP
Flash Card
USB 2.0
USB 3.0
Newsflash
View All
3 hours ago
Nextorage Sub-Brand N/U Releases First Three Products
3 hours ago
TSMC 2nm Wafer Monthly Capacity Reportedly Expected to Reach 120,000 by Year-End
3 hours ago
Nanya Technology Accused of Infringing DRAM Patents Originally Owned by Intel
3 hours ago
ByteDance Subsidiary Reportedly Obtained Nvidia B200 GPUs Through Nscale
4 days ago
Samsung Completes 16GB LPDDR6 Validation on Snapdragon 8 Elite Extreme Gen 6, Achieving 10.7Gbps I/O Speed
4 days ago
Team Group Maintains View That Supply Could Tighten Further in H1 2027
4 days ago
YMTC Wins 3D NAND Patent Battle in Germany; Micron-Related Infringing Products Banned from Sale
4 days ago
BIWIN Plans 4.5 Billion Yuan Investment for Phase III of Wafer-Level Advanced Packaging and Testing Project
4 days ago
Synopsys and TSMC Deepen Partnership to Accelerate Advanced AI Chip Design
2026-09-18 09:58 (UTC+0)
Samsung Said to Launch Galaxy Z TriFold2 Ahead of Schedule
Hot News
View All
US ITC Officially Institutes Section 337 Investigation into DRAM Devices and Downstream Products (III)
Notice of 2026 Mid-Autumn Festival Holiday
YMTC Wins 3D NAND Patent Battle in Germany; Micron-Related Infringing Products Banned from Sale
Holiday Looms: Memory Spot Market Stalls as Price Cuts Fail to Spark Demand
Solidigm Considers Building First U.S. NAND Flash Production Base Amid Surging AI Demand
Huawei AI Chips Accelerate: Ascend 960 Series to Launch Early with Doubled Performance
Shifting to a “Dual-Track” Model? Reports Indicate Samsung Electronics’ HBM Base Die Supply Strategy is Changing