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CFMS | MemoryS
CFMS｜MemoryS 2026: Shenzhen, March 27
Persistent Upstream NAND Price Hikes Prompt Memory Makers to Strengthen Cost Control, Driving Most Finished Product Prices to New Highs
Samsung Electronics' 1c DRAM Yield Reportedly Close to 60%
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CFMS｜MemoryS 2026: Shenzhen, March 27
4 days ago
Industry News
Winbond Electronics: 8Gb DDR4 Now in Shipment, NOR Flash Wafer Starts to Expand to 30K Units by Mid-Year
2026-01-26 10:40 (UTC+0)
Industry News
Samsung Electronics' HBM4E R&D Progress Revealed
2026-01-23 10:44 (UTC+0)
Industry News
Compal: Memory Costs Have Doubled as a Proportion of PC Components
2026-01-23 10:41 (UTC+0)
Industry News
Microsoft Plans to Deploy LPDDR in AI Data Centers
2026-01-22 09:46 (UTC+0)
Industry News
Samsung Plans to Adopt 2nm Process for Custom HBM Logic Chips
2026-01-22 09:42 (UTC+0)
Industry News
Samsung Electronics' 1c DRAM Yield Reportedly Close to 60%
2026-01-16 10:47 (UTC+0)
Industry News
SK Hynix's DRAM production at its Wuxi plant has been upgraded to the 1a process
2026-01-15 08:47 (UTC+0)
Industry News
NVIDIA to Launch GPU R&D Hub in Korea
2026-01-13 08:53 (UTC+0)
Industry News
Intel has officially launched its third-generation Core Ultra processors, codenamed "Panther Lake,"
2026-01-07 11:52 (UTC+0)
Industry News
NVIDIA CEO Jensen Huang stated that the memory chip market represents a completely unserved market
2026-01-07 10:07 (UTC+0)
Industry News
NVIDIA Vera Rubin Enters Full Production, Set to Slash AI Inference Costs by 10-Fold
2026-01-06 02:49 (UTC+0)
Industry News
US ITC Investigates Samsung’s HBM and DDR5 Patent Infringement Claims
2026-01-05 07:13 (UTC+0)
Industry News
HOSIN Global Submits Listing Application to HKEX: H1-H3 2025 Revenue Hits $10.69 Billion, Inventory Exceeds $7.10 Billion
2026-01-04 09:26 (UTC+0)
Industry News
Samsung's Mobile Phone Pricing Strategy Revealed: High-End Models to Maintain Prices, Mid-to-Low-End Models to See Price Hikes
2026-01-04 09:10 (UTC+0)
Industry News
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11 hours ago
Huawei Tops Chinese Smartphone Market in January, Mate 80 Series Sales Exceed 2.54 Million Units
12 hours ago
Samsung Resumes Investment in NAND Flash Memory Production Line at Pyeongtaek Plant
13 hours ago
South Korea's Semiconductor Exports Surge 102.7% in January, Driving Total Exports to Record High
14 hours ago
Lenovo Announces New AI Tablet Legon Y700 for March Release
18 hours ago
AMD Zen 6 Architecture Details Leaked: Core Count Significantly Increased, Area Almost Unchanged
19 hours ago
Xiaomi's Next-Generation SU7 Auto to Enter Mass Production Phase
19 hours ago
Shenghe Jingwei Responds to Second Round of Inquiries for its STAR Market IPO
3 days ago
SanDisk: Revenue Exceeded $3 Billion（Up 61% YoY) with Impressive Performance in AI Data Center Business
3 days ago
Kioxia and Sandisk Extend Yokkaichi Joint Venture Agreement Through 2034
3 days ago
Longsys: Net Profit in 2025 Expected to Increase by 150.66% to 210.82% YoY
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Kioxia and Sandisk Extend Yokkaichi Joint Venture Agreement Through 2034
Kioxia Introduces QLC UFS 4.1 Embedded Flash Memory Devices for High-Capacity Mobile Storage
CFMS｜MemoryS 2026: Shenzhen, March 27
SK hynix Announces FY25 Financial Results
Persistent Supply Shortages Keep NAND Resource Costs Elevated, Driving Continued Price Increases Across OEM, Channel, and Embedded Products
Micron Breaks Ground on Advanced Wafer Fabrication Facility in Singapore
Winbond Electronics: 8Gb DDR4 Now in Shipment, NOR Flash Wafer Starts to Expand to 30K Units by Mid-Year
