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CFMS | MemoryS
2025-2026 Global Memory Market Trend White Paper
Memory Spot Market Industrial SSDs Steady with Moderate Gains; UDIMM,SODIMMs,and Channel SSDs Continue to See Downward Revisions
Samsung: Memory Revenue Contribution Exceeds 50% for First Time, HBM4 Expected to Account for Over Half of Total HBM Sales from Q3
Latest News
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Weekly Review
Samsung Unveils Massive 2,655 Trillion Won Domestic Investment Plan
22 hours ago
Industry News
Applied Materials Unveils Series of 3D Manufacturing Equipment for AI Chips, Targeting HBM Stacking Processes
22 hours ago
Industry News
Lenovo IDG President Luca: Adequate Supply Secured, but Cost Hikes Unavoidable
3 days ago
Industry News
SK Hynix Plans to Build New NAND Fab in Cheongju
4 days ago
Industry News
Memory Giants Spark "U.S. Listing Wave": SK Hynix Finalizes Ticker to Rush Nasdaq, Kioxia Announces ADR Issuance Timeline
4 days ago
Industry News
Samsung Reportedly Halts 8-Hi HBM3E Production, Shifts Capacity to HBM4
5 days ago
Industry News
Samsung NAND Roadmap Leaked: 560+ Layers by 2030, Racing Toward the 1,000-Layer Flash Era
5 days ago
Industry News
SPHBM4 Standard Approved, Breaking the Bottleneck of High HBM Packaging Costs
6 days ago
Industry News
SK hynix shifts to commodity DRAM as margins top HBM, opening Samsung HBM chance
2026-06-23 08:11 (UTC+0)
Industry News
Samsung Convenes Global Strategy Meeting: Focuses on HBM Supply Strategy and Long-Term Agreements
2026-06-22 10:44 (UTC+0)
Industry News
Phison’s K.S. Pua: NAND Flash Will Become an Irreversible Trend; Orders Booked Through Q2 2027
2026-06-22 10:29 (UTC+0)
Industry News
MediaTek Said to Win Exclusive Deal for Upgraded Google TPU v9 Featuring HBM4E Memory
2026-06-22 10:10 (UTC+0)
Industry News
Notice of 2026 Dragon Boat Festival Holiday
2026-06-18 08:34 (UTC+0)
Industry News
Samsung 1d DRAM Mass Production Roadmap Revealed: Equipment Set for Q2 Next Year, Production Could Begin by Year-End
2026-06-17 09:51 (UTC+0)
Industry News
Intel's 18A‑P Process Enters Risk Production Phase
2026-06-17 09:49 (UTC+0)
Industry News
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Newsflash
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22 hours ago
Samsung Unveils Its 2,655 Trillion Won Domestic Investment Plan in South Korea
22 hours ago
ASICLAND Announces Approx. $20.7 Million Cooperative Design Agreement with SK hynix for Next-Gen eSSD Controllers
22 hours ago
Applied Materials Unveils Series of 3D Manufacturing Equipment for AI Chips, Targeting HBM Stacking Processes
22 hours ago
Apple Said to Be Seeking U.S. Government Approval to Procure Chinese Memory Chips
22 hours ago
Samsung's Yongin Campus Construction Plans Reportedly Unchanged, Target Remains to Break Ground by Year-End
3 days ago
Lenovo IDG President Luca: Adequate Supply Secured, but Cost Hikes Unavoidable
3 days ago
TWSC Launches TC301 In-Car Flash Drive, Built with TLC NAND Flash
3 days ago
Samsung Group Reported to Announce 1,000 Trillion Won Decade-Long Investment Plan
3 days ago
Apple Raises Prices on iPad and Mac Series, iPhone Remains Unchanged
4 days ago
Kioxia Responds to Earthquake in Northeastern Japan
Hot News
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SK Hynix Unveils 1100 Trillion Won Medium- to Long-Term Investment Strategy
SK Hynix Plans to Build New NAND Fab in Cheongju
Memory Giants Spark "U.S. Listing Wave": SK Hynix Finalizes Ticker to Rush Nasdaq, Kioxia Announces ADR Issuance Timeline
NAND Prices Decline at the Trading End Amid Cash-Out Pressures, with slight price reductions for 512Gb TLC and 1Tb QLC wafers
Micron and Anthropic Announce Strategic Agreement to Scale Next-Generation AI Infrastructure
SK hynix shifts to commodity DRAM as margins top HBM, opening Samsung HBM chance
Samsung Convenes Global Strategy Meeting: Focuses on HBM Supply Strategy and Long-Term Agreements
