Kioxia has released its financial results for FY25 Q4 (January–March 2026), ending March 31, 2026. During the period, its revenue stood at 1.0029 trillion yen (approximately US$6.97 billion), surging 84.5% quarter-on-quarter and 188.9% year-on-year. On a Non-GAAP basis, operating profit reached 599.1 billion yen (roughly US$4.17 billion), jumping 314.2% quarter-on-quarter and nearly 15 times year-on-year; net profit attributable to parent company owners was 409.9 billion yen (about US$2.85 billion), rising 357.9% quarter-on-quarter and soaring nearly 30 times year-on-year.

According to South Korean media reports, Samsung plans to stop using FOWLP technology on the Exynos 2700, a packaging technology that has been used since the Exynos 2400. It is reported that the Exynos 2700 chip is currently being developed for next year's flagship smartphones. Although FOWLP technology improves heat dissipation performance, Samsung has begun to reassess its profitability due to increased manufacturing costs.

On May 15, Kioxia issued an announcement stating that it is preparing to list American Depositary Shares (ADS) representing its common stock on a U.S. stock exchange in order to expand its investor base and enhance corporate value. The specific details of the listing, such as the timing, exchange, and method of listing, have not yet been determined. Depending on changes during the preparation process, the company may also decide not to proceed with the listing. Kioxia will issue relevant announcements as needed and in a timely manner.

According to media reports, Samsung plans to hold its major second-half launch event, "Galaxy Unpacked," in London on July 22, 2026. The company is expected to unveil several new products, including three foldable phones, AI smart glasses, and a new generation of smartwatches. Samsung may also showcase its smart glasses product, the Galaxy Glasses, for the first time at this event. It is reported that the Galaxy Glasses will run on the Android XR operating system, jointly developed by Samsung and Google, specifically designed to power extended reality smart glasses and head-mounted devices.

According to South Korean media reports, Samsung Electronics has entered emergency management mode on its semiconductor production lines one week ahead of a planned general strike. Industry sources revealed that Samsung began reducing production volumes on the 14th in response to the impending strike. Unlike other industries, semiconductors require production volume and quality control to begin before a strike in order to minimize losses. It is understood that Samsung is limiting the number of new wafers entering production lines and reorganizing its product mix to focus on higher-unit-price, state-of-the-art processes. Additionally, union leaders cited a letter from Samsung Electronics stating that the company proposed on Thursday to resume wage negotiations with the union. The National Labor Relations Commission has also called for another round of talks between the two sides on Saturday. However, Choi Seung-ho, head of Samsung Electronics' largest union, said: “If bonus payments and transparency are not institutionalized, there is no reason to continue dialogue.”

According to sources cited by Reuters, the United States has approved approximately 10 Chinese companies to purchase Nvidia's H200 chips, but no shipments have been delivered to date. Sources indicate that the approved Chinese companies include Alibaba, Tencent, and ByteDance, while Lenovo and Foxconn have received U.S. approval to become distributors of the H200. According to sources, Nvidia CEO Jensen Huang was not initially included on the White House delegation list for a visit to China, but joined the trip at the invitation of President Trump. The visit may ultimately break the deadlock over sales of H200 chips in China.

According to Taiwanese media reports, Li-pen Yuan, Senior Director of Advanced Technology Business Development at TSMC's Business Development Organization, pointed out at the TSMC Technology Symposium that the world's largest 5.5x reticle-size CoWoS has entered mass production, and the current CoWoS yield has reached 98%. It was revealed that TSMC's CoWoS technology will continue to scale rapidly. By 2028, TSMC plans to mass-produce a 14x reticle-size CoWoS capable of integrating 20 HBM stacks. By 2029, the company aims to advance to a version exceeding 14x reticle size, which can integrate 24 HBM stacks.

According to South Korean media reports, Samsung Electronics' union estimates that the 18-day strike could cause losses of up to 30 trillion won. This figure includes an estimated 18 trillion won reduction in operating profit (1 trillion won per day), plus 12 trillion won in losses resulting from the time needed to return to normal operations after the strike ends. Due to the nature of semiconductor manufacturing processes, production lines will require a considerable amount of time to resume normal operation even after the strike ends. Hundreds of precision machines performing nanometer-level processes need recalibration, defective wafers must be discarded, and yields need to be improved until products meet target quality standards. All of them requires a stabilization period. Kim Dong-won, head of research at KB Securities, said: "Assuming the worst-case scenario, even if the strike ends, restarting the automated production lines and resuming normal operations would most likely take two to three weeks."

According to foreign media reports, GF Holdings has revealed that the previously rumored preliminary chip manufacturing agreement between Apple and Intel was signed in December 2025. During a monthly conference call, GFHK stated that Apple will collaborate with Intel to produce two chips. One of these is the Apple M7, built using Intel's 18A-P process and expected to enter production by the end of 2027. This chip will be used in Apple's MacBook lineup. The other chip, likely a mobile processor, may be the A21, which will be manufactured using Intel's 14A process and is expected to enter production by the end of 2028. According to previous rumors, the mobile chip is likely the A21.

Kioxia has announced on its official website the launch of the XG10 series SSDs for PC OEMs, featuring PCIe 5.0 technology and available in capacities of 512 GB, 1024 GB, 2048 GB, and 4096 GB. Compared to the previous generation, XG10 series achieve up to 2x sequential read, more than 2x sequential write, and increases of approximately 122% in random read and 158% in random write performance - supporting faster data access and improved system responsiveness. KIOXIA XG10 series is currently sampling to select PC OEM customers, with PC shipments equipped with the SSD expected to begin from the second quarter of 2026. The new drives will be showcased at Dell Technologies World, taking place May 18–21 in Las Vegas.

Lenovo has unveiled the all-new ThinkPad X13 Gen 7, along with the updated ThinkPad L14 Gen 7 and L16 Gen 3. The ThinkPad X13 Gen 7 is built for professionals and powered by either Intel Core Ultra 300 or AMD Ryzen AI PRO 400 series processors. It introduces a 100% recycled cobalt battery for the first time and weighs as little as 0.93 kg, making it one of the lightest ThinkPads Lenovo has ever produced. The ThinkPad L14 Gen 7 and L16 Gen 3 are designed for large-scale deployment by mainstream enterprise customers. Both models come equipped with Intel Core Ultra 300 or AMD Ryzen AI PRO 400 series processors, and support up to 64GB of DDR5 memory and up to 2TB of SSD storage.

Nicky Lu, Chairman and CEO of Etron Technology, stated yesterday that DRAM prices are currently rising at a rate of 10%–20% per month, with tight supply of DDR4 and DDR5 expected to last at least until mid-next year. He pointed out that the structural changes brought about by AI are comprehensively driving memory demand upward. While the market expects the DRAM price rally to potentially slow after Q3, if demand for new AI applications and new platforms continues to expand, further price increases cannot be ruled out. In addition, the company's order visibility has extended through the end of this year to the first half of next year, and the outlook remains optimistic.

Li Auto has officially announced its self-developed chip, M100, which will debut in the all-new Li L9 Livis model. M100 is claimed to be the first end-side inference chip based on a dataflow architecture. Manufactured using a 5nm automotive-grade process, it delivers up to 1280 TOPS of single-chip computing power, earning the title of "the world's most powerful compute." Leveraging a dynamic dataflow architecture to break through the efficiency bottlenecks of traditional GPUs, and paired with a synchronized model-and-chip development approach, the chip achieves a 40% reduction in end-to-end latency. The vehicle's response speed is said to be twice as fast as that of a human.

According to South Korean media, the second round of post-mediation labor negotiations between Samsung Electronics and its union broke down on the 13th, with the union announcing that it will proceed with the general strike as scheduled. The union demanded that management ensure transparency in performance bonus distribution criteria and abolish the cap on performance bonuses, but both requests were rejected. As a result, the strike will begin as planned on the 21st. If the strike ultimately takes place, it could cause losses of up to 40 trillion Korean won. In the medium to long term, it may also lead to customer attrition and damage the supply chain. It is reported that the government may consider exercising its emergency mediation power.