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CFMS | MemoryS
【CFM Research】Memory Prices to Rise Further in the Second Half of the Year
Memory Spot Market Industrial SSDs Steady with Moderate Gains; UDIMM,SODIMMs,and Channel SSDs Continue to See Downward Revisions
Samsung: Memory Revenue Contribution Exceeds 50% for First Time, HBM4 Expected to Account for Over Half of Total HBM Sales from Q3
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Weekly Review
Google TPU8 Splits Training and Inference, Pioneering a Fine-Grained Paradigm for AI Memory
2026-06-04 10:10 (UTC+0)
Technical
Intrinsic Ferroelectricity Confirmed in Gallium Oxide at Room Temperature, Paving Way for High-Power Memory Integration
2026-03-02 06:30 (UTC+0)
Technical
NVIDIA Partners with Global Operators to Define AI-Native 6G, with Storage as a Key Foundation
2026-03-02 03:09 (UTC+0)
Technical
AMD Zen 6 Leaks: The number of cores increases while the area remains almost unchanged.
2026-02-02 06:05 (UTC+0)
Technical
JEDEC Adds Two New Standards Supporting CXL Technology
2024-09-24 07:53 (UTC+0)
Technical
JEDEC Updates DDR5 Specification for Increased Security Against Rowhammer Attacks, New DDR5-8800 Reference Speed
2024-04-24 09:32 (UTC+0)
Technical
SD Application Specifications Formats
2009-12-26 09:50 (UTC+0)
Technical
SDIO
2009-12-26 09:48 (UTC+0)
Technical
SD Host Controller
2009-12-26 09:45 (UTC+0)
Technical
SD Speed Class
2009-12-26 09:41 (UTC+0)
Technical
SDXC
2009-12-26 09:40 (UTC+0)
Technical
microSDHC
2009-12-26 09:37 (UTC+0)
Technical
miniSDHC
2009-12-26 09:33 (UTC+0)
Technical
SD High-Capacity Cards
2009-12-26 09:32 (UTC+0)
Technical
microSD Card
2009-12-26 09:29 (UTC+0)
Technical
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Newsflash
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3 hours ago
Nextorage Sub-Brand N/U Releases First Three Products
3 hours ago
TSMC 2nm Wafer Monthly Capacity Reportedly Expected to Reach 120,000 by Year-End
3 hours ago
Nanya Technology Accused of Infringing DRAM Patents Originally Owned by Intel
3 hours ago
ByteDance Subsidiary Reportedly Obtained Nvidia B200 GPUs Through Nscale
4 days ago
Samsung Completes 16GB LPDDR6 Validation on Snapdragon 8 Elite Extreme Gen 6, Achieving 10.7Gbps I/O Speed
4 days ago
Team Group Maintains View That Supply Could Tighten Further in H1 2027
4 days ago
YMTC Wins 3D NAND Patent Battle in Germany; Micron-Related Infringing Products Banned from Sale
4 days ago
BIWIN Plans 4.5 Billion Yuan Investment for Phase III of Wafer-Level Advanced Packaging and Testing Project
4 days ago
Synopsys and TSMC Deepen Partnership to Accelerate Advanced AI Chip Design
2026-09-18 09:58 (UTC+0)
Samsung Said to Launch Galaxy Z TriFold2 Ahead of Schedule
Hot News
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US ITC Officially Institutes Section 337 Investigation into DRAM Devices and Downstream Products (III)
Notice of 2026 Mid-Autumn Festival Holiday
YMTC Wins 3D NAND Patent Battle in Germany; Micron-Related Infringing Products Banned from Sale
Holiday Looms: Memory Spot Market Stalls as Price Cuts Fail to Spark Demand
Solidigm Considers Building First U.S. NAND Flash Production Base Amid Surging AI Demand
Huawei AI Chips Accelerate: Ascend 960 Series to Launch Early with Doubled Performance
Shifting to a “Dual-Track” Model? Reports Indicate Samsung Electronics’ HBM Base Die Supply Strategy is Changing
