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CFMS | MemoryS
Q3 2026 Global Memory Market Review and Q4 Outlook
Memory Spot Market Industrial SSDs Steady with Moderate Gains; UDIMM,SODIMMs,and Channel SSDs Continue to See Downward Revisions
Samsung: Memory Revenue Contribution Exceeds 50% for First Time, HBM4 Expected to Account for Over Half of Total HBM Sales from Q3
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Google TPU8 Splits Training and Inference, Pioneering a Fine-Grained Paradigm for AI Memory
2026-06-04 10:10 (UTC+0)
Technical
Intrinsic Ferroelectricity Confirmed in Gallium Oxide at Room Temperature, Paving Way for High-Power Memory Integration
2026-03-02 06:30 (UTC+0)
Technical
NVIDIA Partners with Global Operators to Define AI-Native 6G, with Storage as a Key Foundation
2026-03-02 03:09 (UTC+0)
Technical
AMD Zen 6 Leaks: The number of cores increases while the area remains almost unchanged.
2026-02-02 06:05 (UTC+0)
Technical
JEDEC Adds Two New Standards Supporting CXL Technology
2024-09-24 07:53 (UTC+0)
Technical
JEDEC Updates DDR5 Specification for Increased Security Against Rowhammer Attacks, New DDR5-8800 Reference Speed
2024-04-24 09:32 (UTC+0)
Technical
SD Application Specifications Formats
2009-12-26 09:50 (UTC+0)
Technical
SDIO
2009-12-26 09:48 (UTC+0)
Technical
SD Host Controller
2009-12-26 09:45 (UTC+0)
Technical
SD Speed Class
2009-12-26 09:41 (UTC+0)
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SDXC
2009-12-26 09:40 (UTC+0)
Technical
microSDHC
2009-12-26 09:37 (UTC+0)
Technical
miniSDHC
2009-12-26 09:33 (UTC+0)
Technical
SD High-Capacity Cards
2009-12-26 09:32 (UTC+0)
Technical
microSD Card
2009-12-26 09:29 (UTC+0)
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Newsflash
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8 hours ago
Seagate Launches FireCuda Forge Device
8 hours ago
SK hynix HBM4 Yield Reportedly Exceeds 70%
1 day ago
Samsung Electronics Reportedly Partnering with AMD to Develop Advanced Semiconductor Testing Infrastructure
1 day ago
Sandisk Expands IoT Portfolio with New SANDISK iNAND CL EM181 Embedded Flash Drive
1 day ago
AMD Unveils MEXT Memory Management Solution, Halving DRAM Usage Through AI
1 day ago
CoreWeave: Raises Full-Year Revenue Guidance, Capacity for Next Year Essentially Sold Out
1 day ago
AMD to Supply Fifth-Generation EPYC Server CPUs for Google Cloud TPU 8tx
2026-11-03 08:58 (UTC+0)
Raspberry Pi 5 and Compute Module 5 16GB Versions Officially Announced Price Increase Due to Insufficient DRAM Supply
2026-11-03 08:58 (UTC+0)
DeepSeek V5 Reportedly Plans to Use Ascend 950 for Training
2026-10-29 09:52 (UTC+0)
Microsoft CFO: 2027 Full-Year Capital Expenditures to Reach $170 Billion
Hot News
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26Q4 DDR5 RDIMM contract prices rise 10%–15%; CFM raises November DDR5 quotes
Channel Consumer SSD and Embedded eMMC Prices Continued to Decline; Industry SSD/DRAM Modules and LPDDR Hold Steady
Channel SSD Prices Fall Broadly as Aggressive Cuts Weigh on Market
Nvidia’s HBM Strategy Shifts: Samsung, SK Hynix to Mass-Produce 8-Layer HBM4 at Scale in Q2 Next Year
NVIDIA's Jensen Huang: Unlikely to See DRAM Oversupply by 2029
SK Hynix Suspends Solidigm’s U.S. IPO Plans
Report: Samsung Xi’an and SK Hynix Dalian Advance NAND Production Line Upgrades
