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CFMS | MemoryS
CFMS|MemoryS 2026: Shenzhen, March 27
Persistent Upstream NAND Price Hikes Prompt Memory Makers to Strengthen Cost Control, Driving Most Finished Product Prices to New Highs
Samsung Electronics' 1c DRAM Yield Reportedly Close to 60%
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AMD Zen 6 Leaks: The number of cores increases while the area remains almost unchanged.
17 hours ago
Technical
JEDEC Adds Two New Standards Supporting CXL Technology
2024-09-24 07:53 (UTC+0)
Technical
JEDEC Updates DDR5 Specification for Increased Security Against Rowhammer Attacks, New DDR5-8800 Reference Speed
2024-04-24 09:32 (UTC+0)
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SD Application Specifications Formats
2009-12-26 09:50 (UTC+0)
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SDIO
2009-12-26 09:48 (UTC+0)
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SD Host Controller
2009-12-26 09:45 (UTC+0)
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SD Speed Class
2009-12-26 09:41 (UTC+0)
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SDXC
2009-12-26 09:40 (UTC+0)
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microSDHC
2009-12-26 09:37 (UTC+0)
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miniSDHC
2009-12-26 09:33 (UTC+0)
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SD High-Capacity Cards
2009-12-26 09:32 (UTC+0)
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2009-12-26 09:29 (UTC+0)
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miniSD Card
2009-12-26 08:22 (UTC+0)
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2009-12-26 08:18 (UTC+0)
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2009-12-26 08:05 (UTC+0)
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13 hours ago
Huawei Tops Chinese Smartphone Market in January, Mate 80 Series Sales Exceed 2.54 Million Units
14 hours ago
Samsung Resumes Investment in NAND Flash Memory Production Line at Pyeongtaek Plant
15 hours ago
South Korea's Semiconductor Exports Surge 102.7% in January, Driving Total Exports to Record High
15 hours ago
Lenovo Announces New AI Tablet Legon Y700 for March Release
19 hours ago
AMD Zen 6 Architecture Details Leaked: Core Count Significantly Increased, Area Almost Unchanged
20 hours ago
Xiaomi's Next-Generation SU7 Auto to Enter Mass Production Phase
21 hours ago
Shenghe Jingwei Responds to Second Round of Inquiries for its STAR Market IPO
3 days ago
SanDisk: Revenue Exceeded $3 Billion(Up 61% YoY) with Impressive Performance in AI Data Center Business
3 days ago
Kioxia and Sandisk Extend Yokkaichi Joint Venture Agreement Through 2034
3 days ago
Longsys: Net Profit in 2025 Expected to Increase by 150.66% to 210.82% YoY
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Kioxia and Sandisk Extend Yokkaichi Joint Venture Agreement Through 2034
Kioxia Introduces QLC UFS 4.1 Embedded Flash Memory Devices for High-Capacity Mobile Storage
CFMS|MemoryS 2026: Shenzhen, March 27
SK hynix Announces FY25 Financial Results
Persistent Supply Shortages Keep NAND Resource Costs Elevated, Driving Continued Price Increases Across OEM, Channel, and Embedded Products
Micron Breaks Ground on Advanced Wafer Fabrication Facility in Singapore
Winbond Electronics: 8Gb DDR4 Now in Shipment, NOR Flash Wafer Starts to Expand to 30K Units by Mid-Year