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CFMS | MemoryS
CFMS｜MemoryS 2026: Shenzhen, March 27
Global Memory Market Hits Record High, 4Q25 DRAM/NAND Flash Revenue Market Share Rankings Released
Samsung Electronics' 1c DRAM Yield Reportedly Close to 60%
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Weekly Review
Intrinsic Ferroelectricity Confirmed in Gallium Oxide at Room Temperature, Paving Way for High-Power Memory Integration
2026-03-02 06:30 (UTC+0)
Technical
NVIDIA Partners with Global Operators to Define AI-Native 6G, with Storage as a Key Foundation
2026-03-02 03:09 (UTC+0)
Technical
AMD Zen 6 Leaks: The number of cores increases while the area remains almost unchanged.
2026-02-02 06:05 (UTC+0)
Technical
JEDEC Adds Two New Standards Supporting CXL Technology
2024-09-24 07:53 (UTC+0)
Technical
JEDEC Updates DDR5 Specification for Increased Security Against Rowhammer Attacks, New DDR5-8800 Reference Speed
2024-04-24 09:32 (UTC+0)
Technical
SD Application Specifications Formats
2009-12-26 09:50 (UTC+0)
Technical
SDIO
2009-12-26 09:48 (UTC+0)
Technical
SD Host Controller
2009-12-26 09:45 (UTC+0)
Technical
SD Speed Class
2009-12-26 09:41 (UTC+0)
Technical
SDXC
2009-12-26 09:40 (UTC+0)
Technical
microSDHC
2009-12-26 09:37 (UTC+0)
Technical
miniSDHC
2009-12-26 09:33 (UTC+0)
Technical
SD High-Capacity Cards
2009-12-26 09:32 (UTC+0)
Technical
microSD Card
2009-12-26 09:29 (UTC+0)
Technical
miniSD Card
2009-12-26 08:22 (UTC+0)
Technical
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11 hours ago
Seagate Launches FireCuda X1070 Series PCIe 4.0 SSD, Supports Up to 4TB Capacity
11 hours ago
Alibaba Latest Earnings: Net Profit Drops over 60% YoY, AI Revenue Sees Triple-Digit Growth
11 hours ago
Unitree Robotics' IPO Application Accepted on the Science and Technology Innovation Board; Plans to Raise 4.202 Billion Yuan
12 hours ago
XPeng Motors 2025 Financial Report: Full-Year Revenue Up 87.7%, First Profit in Q4
13 hours ago
Lenovo and NVIDIA Launch Next-Generation Hybrid AI Solution
15 hours ago
Silicon Power Launches DDR5 RDIMM Memory
15 hours ago
Reports Indicate Price of Intel Consumer CPUs to Rise by 10%
18 hours ago
Kioxia Announces Discontinuation of TSOP-Packaged SLC/MLC Products
19 hours ago
Shanghai Issues Notice on Organizing the Construction of Industry Nodes for the National Computing Power Interconnection System
1 day ago
Tesla CEO Elon Musk: AI6 Chip Expected to Tape Out in December, Single Chip May Match A Dual SoC AI5
Hot News
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Spot Market Inversion Worsens: Prices for Industrial Low-Capacity SSDs, DDR SODIMM, and LPDDR4X Products Increased This Week
SK hynix to Showcase AI Memory Leadership at NVIDIA GTC 2026
Samsung and Micron Split Initial LPDDR5X Orders for S26 Series, Subsequent Price Negotiations Uncertain
SK hynix and Sandisk Begin Global Standardization of Next-Generation Memory ‘HBF’
Samsung Electronics' 1c DRAM Yield Exceeds 80%, HBM4 Yield Approaches 60%
South Korea's Semiconductor Exports Surge 134.1% in First 20 Days of February
Notice of Chinese New Year Holiday
