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CFMS | MemoryS
Q3 2026 Global Memory Market Review and Q4 Outlook
Memory Spot Market Industrial SSDs Steady with Moderate Gains; UDIMM,SODIMMs,and Channel SSDs Continue to See Downward Revisions
Samsung: Memory Revenue Contribution Exceeds 50% for First Time, HBM4 Expected to Account for Over Half of Total HBM Sales from Q3
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Weekly Review
Google TPU8 Splits Training and Inference, Pioneering a Fine-Grained Paradigm for AI Memory
2026-06-04 10:10 (UTC+0)
Technical
Intrinsic Ferroelectricity Confirmed in Gallium Oxide at Room Temperature, Paving Way for High-Power Memory Integration
2026-03-02 06:30 (UTC+0)
Technical
NVIDIA Partners with Global Operators to Define AI-Native 6G, with Storage as a Key Foundation
2026-03-02 03:09 (UTC+0)
Technical
AMD Zen 6 Leaks: The number of cores increases while the area remains almost unchanged.
2026-02-02 06:05 (UTC+0)
Technical
JEDEC Adds Two New Standards Supporting CXL Technology
2024-09-24 07:53 (UTC+0)
Technical
JEDEC Updates DDR5 Specification for Increased Security Against Rowhammer Attacks, New DDR5-8800 Reference Speed
2024-04-24 09:32 (UTC+0)
Technical
SD Application Specifications Formats
2009-12-26 09:50 (UTC+0)
Technical
SDIO
2009-12-26 09:48 (UTC+0)
Technical
SD Host Controller
2009-12-26 09:45 (UTC+0)
Technical
SD Speed Class
2009-12-26 09:41 (UTC+0)
Technical
SDXC
2009-12-26 09:40 (UTC+0)
Technical
microSDHC
2009-12-26 09:37 (UTC+0)
Technical
miniSDHC
2009-12-26 09:33 (UTC+0)
Technical
SD High-Capacity Cards
2009-12-26 09:32 (UTC+0)
Technical
microSD Card
2009-12-26 09:29 (UTC+0)
Technical
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Newsflash
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10 hours ago
Apple: Memory Supply Shortage Is a Crisis, Considering All Options
10 hours ago
Qualcomm and Transsion Reach Long-Term Patent License Agreement, Valid Through End of 2031
10 hours ago
Report: Standard iPhone 18 to Start Mass Production in Late November with Massive Component Stockpiles
10 hours ago
Longsys: Q3 Revenue Expected to Reach RMB 13.9–15.9 Billion, Up 112.76%–145.35% YoY
10 hours ago
SK hynix Unveils 3D FeNAND A-CiM Technology
10 hours ago
Phison's R&D Expenses in 2026 Expected to Exceed NT$50 Billion
10 hours ago
Institution: Global Smartphone Shipments Fell 20% YoY in 3Q26, with Increasingly Polarized Brand Competition
10 hours ago
ByteDance Said to Be in Talks to Buy MediaTek Data Center Chips
2 days ago
Marvell Unveils Second-generation Structera X, Industry-first Six-channel CXL 3.2 Memory Expanders
2 days ago
Samsung Electronics Reportedly Also Developing Next-Generation 4F² VCT DRAM
Hot News
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Apple CEO Responds to Memory Crisis: Evaluating All Options
Memory Module Prices Rise, While Low-Capacity eMMC Slips
Samsung Electronics Expands zNAND Product Line as NAND Flash Accelerates Toward Customization
Rising Wafer Foundry Cost Drives Up CPU Prices, Intel/Qualcomm/AMD Hike Prices in Succession
CFM：Q3 2026 Global Memory Market Review and Q4 Outlook
Notice of National Day Holiday
Kioxia Joins Applied Materials' EPIC Center to Co-Develop Next-Generation Advanced Memory Technology
