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CFMS | MemoryS
【CFM Research】Memory Prices to Rise Further in the Second Half of the Year
Memory Spot Market Industrial SSDs Steady with Moderate Gains; UDIMM,SODIMMs,and Channel SSDs Continue to See Downward Revisions
Samsung: Memory Revenue Contribution Exceeds 50% for First Time, HBM4 Expected to Account for Over Half of Total HBM Sales from Q3
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Weekly Review
Google TPU8 Splits Training and Inference, Pioneering a Fine-Grained Paradigm for AI Memory
2026-06-04 10:10 (UTC+0)
Technical
Intrinsic Ferroelectricity Confirmed in Gallium Oxide at Room Temperature, Paving Way for High-Power Memory Integration
2026-03-02 06:30 (UTC+0)
Technical
NVIDIA Partners with Global Operators to Define AI-Native 6G, with Storage as a Key Foundation
2026-03-02 03:09 (UTC+0)
Technical
AMD Zen 6 Leaks: The number of cores increases while the area remains almost unchanged.
2026-02-02 06:05 (UTC+0)
Technical
JEDEC Adds Two New Standards Supporting CXL Technology
2024-09-24 07:53 (UTC+0)
Technical
JEDEC Updates DDR5 Specification for Increased Security Against Rowhammer Attacks, New DDR5-8800 Reference Speed
2024-04-24 09:32 (UTC+0)
Technical
SD Application Specifications Formats
2009-12-26 09:50 (UTC+0)
Technical
SDIO
2009-12-26 09:48 (UTC+0)
Technical
SD Host Controller
2009-12-26 09:45 (UTC+0)
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SD Speed Class
2009-12-26 09:41 (UTC+0)
Technical
SDXC
2009-12-26 09:40 (UTC+0)
Technical
microSDHC
2009-12-26 09:37 (UTC+0)
Technical
miniSDHC
2009-12-26 09:33 (UTC+0)
Technical
SD High-Capacity Cards
2009-12-26 09:32 (UTC+0)
Technical
microSD Card
2009-12-26 09:29 (UTC+0)
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Newsflash
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1 hour ago
Samsung Reportedly Plans to Change Use of DRAM Production Line at Giheung New Plant
1 hour ago
LG and NVIDIA Sign MOU, Next-Generation Humanoid Robot to Launch in 1Q27
1 hour ago
Sandisk Announces FY2028–2030 Financial Targets, Pledges 100% of Excess Cash Back to Shareholders
2 days ago
Tencent Q2 Revenue Rises 11% YoY to RMB 204.79 Billion, Capital Expenditure Jumps 65% QoQ
2 days ago
Samsung Reportedly Introduces Claude Model to Boost Efficiency in Semiconductor Development and Verification
2 days ago
Samsung Reportedly Plans to Apply High-NA EUV Technology to 1nm Process Mass Production
2 days ago
Nvidia Reportedly Plans Late Fall Release for Trillion-Parameter AI Model Nemotron 4
3 days ago
SK hynix Reportedly Becomes Largest Shareholder of Japan's Kioxia
3 days ago
SK hynix Reportedly Advancing EUV Process, Begins Introducing New Material PSM
3 days ago
Longsys Q2 Revenue Up 43.1% QoQ, H1 Net Profit Soars 71,528% YoY
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Sandisk Announces FY2028–2030 Financial Targets, Pledges 100% of Excess Cash Back to Shareholders
Report: Samsung to Shift Legacy Memory Back-End Operations to Vietnam, Pivoting Domestic Capacity Entirely Toward HBM
CFM: Server DDR5 Memory Prices Rise Across the Board This Month; 32GB DDR5 RDIMM Surges Over 20%
Samsung's HBM4 Achieves "Golden Yield" 4 Months Early, HBM4E Development on Track
SK hynix Invests 54 Trillion Won in Yongin Y2 and Cheongju M17 to Secure Mid-to-Long-Term Production Base for AI Memory Demand
CFM: Soaring Memory Costs Suppress End-User Demand; Consumer-Grade NAND Market Faces Pressure in Q4
New 3D Flash Memory Technology from Kioxia and Sandisk Achieves Industry’s Highest Bit Density for QLC NAND
