Micron Technology announced financial results for its second quarter of fiscal 2026 (ended February 26, 2026), covering the period from December 2025 to February 2026. Revenue reached $23.86 billion, representing a substantial sequential increase of 75% and a year-over-year surge of 196%. On a non-GAAP basis, operating income was $16.455 billion, with operating margin expanding to 69% from 47% in the prior quarter. Net income reached $14.021 billion, up 156% sequentially and 686% year-over-year.

Recently, an international research team led by the Politecnico di Milano in Italy, in collaboration with the Institute for Photonics and Nanotechnologies of the Italian National Research Council (CNR-IFN), has successfully developed an ultra-fast computer controlled by light. The team achieved ultra-fast logic operations in novel two-dimensional Semiconductor materials using femtosecond laser pulses, reaching speeds more than 100 times faster than the fastest electronic devices available today. This achievement demonstrates for the first time that light can not only transmit information but also directly process it, opening new pathways for breakthroughs in future computing performance. The related paper has been published in the latest issue of Nature Photonics.

SK hynix memory solutions are designed to minimize data bottlenecks and maximize performance for both AI training and inference in NVIDIA AI infrastructure. Through its participation in GTC 2026, SK hynix plans to demonstrate its competitive edge in memory technology—the core infrastructure of the AI era.

Micron Technology recently announced the completion of its acquisition of the P5 wafer fab from Powerchip Semiconductor Manufacturing Corporation (PSMC) in Tongluo, Miaoli County, Taiwan, China, for a total transaction value of $1.8 billion. The site will serve as a strategic extension of Micron’s large-scale Taichung campus, forming a vertically integrated ecosystem with Micron’s Taichung plant approximately 15 miles away, further strengthening Micron’s industrial presence in the region.

According to South Korean media citing industry sources, Samsung Electronics is collaborating with NVIDIA to accelerate the development of next-generation NAND flash memory. Researchers from Samsung Electronics' Semiconductor Research Institute, Nvidia, and Georgia Institute of Technology developed a "Physics-Informed Neural Operator (PINO)" model capable of analyzing ferroelectric-based NAND device performance more than 10,000 times faster than conventional methods. The research findings were published to the academic community on the 6th.Based on these results, Samsung is working with NVIDIA to develop and commercialize ferroelectric NAND flash memory.

On March 10th, US time, Applied Materials, a global leader in Semiconductor manufacturing equipment, announced that Micron and SK Hynix have become founding partners of its EPIC Center in Silicon Valley, jointly advancing the development of next-generation memory technologies to support the development of AI and high-performance computing industries.

On March 9th, the Jinshan District People's Government of Shanghai and Alibaba Cloud signed a strategic cooperation agreement to accelerate the construction of Alibaba's Apsara Cloud Intelligent East China Computing Center. With a total investment of 40 billion yuan, the center was already established in Jinshan in 2021. Upon completion, it will become one of the largest intelligent computing hubs in East China, injecting strong momentum into Shanghai's development as an AI powerhouse.

Recently, Beijing University of Posts and Telecommunications, in collaboration with Hong Kong Polytechnic University and other institutions, experimentally verified the room-temperature intrinsic ferroelectricity of gallium oxide, an ultrawide bandgap Semiconductor. The findings were published in Science Advances. Using MOCVD technology, the team successfully fabricated epitaxial κ-Ga₂O₃ thin films and observed stable ferroelectric switching, achieving devices with an on/off ratio exceeding 10⁵ and endurance over 10⁷ cycles. The finding resolves the long-standing conflict between the rigid structure required for wide bandgap Semiconductors and the atomic flexibility needed for ferroelectricity, paving the way for integrating high-power and non-volatile memory functions in a single material platform.

On February 27, Rapidus announced on its official website that it has completed a total financing of 267.6 billion yen (approximately RMB 11.8 billion), with funds coming from the Japanese government and private enterprises. Among this, an independent administrative agency under Japan's Ministry of Economy, Trade and Industry injected 100 billion yen (approximately RMB 4.4 billion). Rapidus will secure funding based on investments and loans from the government and private sector, steadily transitioning from the current research and development phase to the mass production of 2nm logic Semiconductors, with plans to achieve mass production goals by 2027.

Semiconductor exports soared by 134.1% to $15.12 billion, accounting for 34.7% of the total export value, a rise of 16.4 percentage points from the previous year.

ASML has recently announced a significant breakthrough in extreme ultraviolet (EUV) lithography technology, successfully increasing the power of its light source from 600 watts to 1,000 watts. This advancement is expected to enhance chip production capacity by 50% by 2030, enabling major Semiconductor manufacturers like TSMC and Intel to significantly boost production to meet the growing demand in artificial intelligence (AI) and high-performance computing (HPC).

SHENZHEN, February 12, 2026 — The Shenzhen Municipal Bureau of Industry and Information Technology has issued the “Artificial Intelligence+ Advanced Manufacturing Action Plan (2026–2027)”, marking a strategic shift in the city’s AI and Semiconductor policy. For the first time, the plan officially supports emerging chip architectures such as in-memory computing and compute-in-memory (CIM) processors, targeting AI applications in smartphones, intelligent robots, and autonomous vehicles. It emphasizes the development of high-performance SoC control chips and promotes domestic alternatives in core AI components.

Hua Hong Semiconductor (01347.HK; 688347.SH) today announced its fourth quarter and full-year results for 2025. Fourth-quarter revenue reached US$659.9 million, a year-on-year increase of 22.4% and a quarter-on-quarter increase of 3.9%, setting a new record high; gross margin was 13.0%, an increase of 1.6 percentage points year-on-year; full-year revenue was US$2.4021 billion, a year-on-year increase of 19.9%; gross margin was 11.8%, an increase of 1.6 percentage points year-on-year; the company's average capacity utilization rate for the year reached 106.1%, a leading level among wafer foundries, reflecting strong market demand and the company's robust operational efficiency.

On February 11(local time), Micron CFO Mark Murphy stated at a Semiconductor conference held by Wolfe Research that the company has achieved mass production and commenced customer shipments of HBM4. In response to recent speculation that Micron may be excluded from NVIDIA's HBM4 supply chain, Micron denied expectations that Samsung Electronics and SK Hynix would divide the entire HBM4 supply volume. Murphy further indicated that Micron's HBM4 shipments are steadily increasing in the first quarter of this year, which is one quarter earlier than the timeline projected during the December 2024 earnings call. The company’s entire 2026 HBM production capacity is already sold out. HBM4 production yields are progressing according to plan, while Micron's HBM4 product delivers performance exceeding 11 Gb/s.

On February 11, 2026, the South Korean Ministry of Trade, Industry and Energy announced at a symposium on the growth strategy of core AI Semiconductor companies that it plans to invest 4.5 trillion won (approximately 21.6 billion yuan) to build a 12-inch 40nm process wafer fab. This aims to address the shortage of foundry capacity for domestic fabless companies and support their R&D and commercialization. Simultaneously, the government will collaborate with Samsung Foundry to provide IP sharing and MPW services, establish a 2 trillion won (approximately 9.6 billion yuan) special account, invest 1 trillion won (approximately 4.8 billion yuan) over the next five years to promote AI Semiconductor development, and cultivate professional talent outside the Seoul metropolitan area, comprehensively strengthening the competitiveness of the Semiconductor industry.