According to South Korean media reports, Samsung Electronics has officially restarted its investment in the NAND flash memory production line at its P4 plant in Pyeongtaek, with related production equipment beginning to be moved into the plant.

The results significantly exceeded the previous record set in 2024. The annual revenue increased by more than 30 trillion won while the annual operating profit nearly doubled year-on-year, marking the highest annual performance in the company’s history.

Samsung Electronics employs a 4nm process for HBM4 logic dies. The chip development and mass production are handled by the System LSI division and the Foundry division within the Device Solutions (DS) business unit. Furthermore, Samsung has been confirmed to be designing logic chips for custom HBM using a 2nm process.

Micron expects this acquisition to contribute to meaningful DRAM wafer output beginning in the second half of calendar 2027.

SK Hynix announced on Jan. 13 that it has decided to make a new investment in the advanced packaging fab P&T7 to stably respond to global artificial intelligence (AI) memory demand and optimize production at the Cheongju fab.”

NVIDIA will establish a research and development (R&D) hub in Korea. This follows up on the commitment made by NVIDIA CEO Jensen Huang, who visited Korea in October last year and announced plans to supply over 260,000 high-performance AI Semiconductors.

Netlist claims that Samsung Electronics’ core memory products, including High Bandwidth Memory (HBM) and DDR5, have infringed on its technology patents. The company has requested the ITC to issue exclusion orders and cease-and-desist orders to prevent the import of the allegedly infringing products into the United States.

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Sources: Samsung Pyeongtaek P4 Fab Construction Accelerated, HBM4 Mass Production Likely to Kick Off Earlier

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Samsung and Samsung Advanced Institute of Technology on Tuesday unveiled its technology to make DRAM smaller than 10-nanometer (nm).

According to industry sources on Dec. 1, Samsung Electronics’ HBM production volume has recently expanded to 170,000 wafers per month based on wafer input, surpassing SK Hynix’s 160,000 wafers. Samsung Electronics had previously maintained around 150,000 wafers per month.