KYEC provides packaging and testing services for the back-end process of semiconductor production globally. The provided services include wafer probing, final product test, burn-in test, assembly services and other services. The production line covers Memory, Logic and Mixed-Signal, System on Chip (SOC), CMOS Image sensor (CIS) / Charge-Coupled Device (CCD), Liquid Crystal Display Driver (LCDD), Radio Frequency (RF) / Wireless and Micro Electro Mechanical system (MEMS) test solutions. KYEC has over 4800 test platforms in total. KYEC provides packaging services for Ball Grid Array (BGA), Quad Flat No-Lead (QFN)/Dual Flat No-Lead (DFN), Thin Small Outline Packages (TSOP), Land grid array (LGA), Embedded Multimedia Card (eMMC) / embedded Multi Chip Package (eMCP), Memory Card/ MICRO SD Card.
