According to South Korean media outlet Chosunbiz, citing semiconductor industry sources, SK hynix's HBM4 yield has recently surpassed 70%.

According to reports, AMD released MEXT predictive Memory software at its In Depth technical forum. It uses AI to manage data placement between DRAM and SSD, temporarily staging less-used data on flash storage, and then uses AI to predict subsequent demand and move it back to DRAM in advance, reducing the time applications wait for data. Tests of specific agent workloads demonstrated by the company showed that DRAM usage could be halved while still retaining 99% of the performance of an all-DRAM configuration.

Server DDR5 RDIMM prices from major Memory suppliers remain on an upward trend in the fourth quarter. The gap between long-term agreement (LTA) and non-LTA prices has widened further. LTA customers have locked in price caps to control Memory costs and secure stable deliveries, while suppliers are allocating additional supply to non-LTA customers at higher prices. DDR5 RDIMM contract prices have generally risen by 10% to 15%, with the average selling price (ASP) of high-capacity RDIMMs exceeding $3/Gb. CFM has raised its November prices for 32GB/64GB/96GB DDR5 RDIMMs to $1,030/$1,800/$3,025.

At the beginning of November, overall spot market demand for Memory continued the sluggish condition from last month, with actual transaction remaining weak. Channel consumer SSD and embedded eMMC prices continued to decline slightly, while industry SSD, Memory modules, and LPDDR4X/5X prices were generally flat.

Apple announced financial results for its fiscal 2026 fourth quarter ended September 26, 2026. According to Apple CFO Kevan Parekh, excluding tariff rebates from the June and September fiscal quarters, both company and product gross margins declined by about 1 percentage point quarter over quarter, driven primarily by rising Memory cost. Apple issued gross margin guidance of 45% to 46% for the next fiscal quarter, below analyst expectation, with the decline mainly due to rising Memory cost and investments related to Siri AI.

Silicon Motion announced its financial results for the third quarter of 2026. During the reporting period, the company achieved revenue of $560 million, setting a record high for the fourth consecutive quarter, up 24% QoQ and 131% YoY; Non-GAAP net income was $149 million, up 79.4% QoQ and 341% YoY.

Historically, the Double 11 shopping festival is an important period for 3C sales. However, SSDs, a key component for channel PC systems and DIY builds, have seen sharp price increases since Q4 last year, tracking the rise in upstream resource costs. Although prices turned lower in Q2 due to weak seasonal demand, the cumulative gains from the earlier rally remain substantial, and current price levels are still significantly above those before last year’s increase.Even with platform subsidies and additional promotions during Double 11, many consumers still view SSDs as expensive. Unless purchases are urgent, most users remain reluctant to buy.

According to South Korean media outlet ZDNet, Samsung Electronics and SK Hynix plan to begin mass production and shipments of 8-layer HBM4 products to Nvidia starting in the second quarter of 2027. HBM4 is the sixth generation of high-bandwidth Memory. Currently, the main HBM4 products in mass production at both companies remain the 12-layer HBM4 variant.

According to foreign media reports, NVIDIA CEO Jensen Huang stated in a recent interview that he believes the likelihood of an oversupply in the DRAM market around 2029 is low.

According to Reuters, citing people familiar with the matter, Samsung Electronics and SK Hynix are upgrading their NAND flash production lines at factories in China. The goal is to raise stacking levels to above 200 layers, bringing the technology level of their Chinese plants closer to that of their South Korean facilities.

This week, the spot Memory market showed a divergent trend. 16GB/32GB DDR5 UDIMM continued to see slight price increases due to rising resource costs. Conversely, the LPDDR4X market faced downward pressure on 8GB pricing, driven by ample supply and persistent weak demand. Prices for other finished Memory products remained largely flat.

Apple CEO John Ternus stated in a recent interview that the current Memory supply shortage has become a clear crisis, and that Apple's fundamental position is to evaluate and consider all viable options. His remarks are seen as a response to national security concerns raised by the U.S. Congress regarding the testing of China-made Memory chips.

SK hynix disclosed that its research team focused on analog compute-in-Memory (A-CiM), and proposed an approach based on 3D FeNAND that co-optimizes cell, non-cell, and page schemes. SK hynix's research team found that 3D FeNAND outperforms conventional 3D CTN NAND in precisely controlling multiple current levels at a lower power, making it a Memory architecture highly suitable for A-CiM. Under the same chip-area constraints, it also delivered approximately 10 to 20 times higher throughput and around 4,000 to 5,000 times greater energy efficiency than conventional 3D arrays.

Marvell Unveils second-generation Structera X, which are industry-first Six-channel CXL 3.2 Memory Expanders for AI Inference. Second-generation Marvell Structera X 3406 and 3506 CXL 3.2 Memory expanders add six DDR4/DDR5 channels (50% more than the prior generation) and PCIe Gen 6 connectivity, supporting up to 9TB of DDR4 or 6TB of DDR5 per controller.

Following the National Day holiday, the current spot Memory market has yet to regain momentum, with trading sentiment remaining sluggish. Finished product prices showed mixed performance: driven by rising resource costs, most channel and industry Memory modules saw slight price increases, while embedded eMMC/UFS products with capacities of 64GB and below experienced price declines this week due to persistently weak demand and continuously falling trade prices for related finished goods.