Seagate has launched a new FireCuda X1070 SSD on its official website, designed specifically for gaming PCs and handheld consoles. The product adopts the M.2 2280 form factor and supports the PCIe 4.0 x4 interface and NVMe 1.4 protocol. FireCuda X1070 SSD features a DRAM-less low-power storage design, powered by a Tenafe TC2201 controller chip paired with Micron's 232-layers 3D QLC NAND flash Memory. It is available in 1TB, 2TB, and 4TB capacity options.

Samsung Electronics announced it has signed a Memorandum of Understanding (MOU) with AMD to expand their strategic collaboration on next-generation AI Memory and computing technologies.Under the MOU, Samsung and AMD will align on primary HBM4 supply for the next-generation AMD AI accelerator, the AMD Instinct MI455X GPU, as well as advanced DRAM solutions for 6th Gen AMD EPYC CPUs, codenamed "Venice". These technologies will support next-generation AI systems combining AMD Instinct GPUs, AMD EPYC CPUs and rack-scale architectures such as the AMD Helios platform. Samsung and AMD will also work together on high-performance DDR5 Memory optimized for the 6th Gen AMD EPYC CPUs.

Micron Technology announced financial results for its second quarter of fiscal 2026 (ended February 26, 2026), covering the period from December 2025 to February 2026. Revenue reached $23.86 billion, representing a substantial sequential increase of 75% and a year-over-year surge of 196%. On a non-GAAP basis, operating income was $16.455 billion, with operating margin expanding to 69% from 47% in the prior quarter. Net income reached $14.021 billion, up 156% sequentially and 686% year-over-year.

On March 18, Alibaba Cloud issued a price adjustment notice on its official website for AI computing and Memory products. Due to a significant increase in procurement costs, the company has decided to adjust prices for services including AI computing and CPFS (AI Computing Version) starting April 18, 2026. Among the adjustments, computing card products such as the T-Head Zhenwu 810E will see price increases ranging from 5% to 34%, while CPFS (AI Computing Version) will increase by 30%.

Recently, following NAND quotations released by certain upstream suppliers, the per-GB price of 512Gb NAND has broken through the $0.35 mark, while 1Tb NAND has risen to around $0.22. However, the current spot market inversion is severe, with wafer prices remaining at high levels on the trading side and buyer sentiment in the market remaining weak.

Kioxia has announced a new category of SSD products, Super High IOPS SSD, which enables the GPU to directly access high-speed flash Memory as an expansion to High Bandwidth Memory (HBM) in AI systems. The new Super High IOPS SSD, the KIOXIA GP Series, is purpose-built to meet the growing performance demands of AI and high-performance computing, providing larger GPU-accessible Memory capacity for faster data access to AI workloads. Evaluation samples of KIOXIA GP Series will be available to select customers by the end of 2026.

SK hynix Memory solutions are designed to minimize data bottlenecks and maximize performance for both AI training and inference in NVIDIA AI infrastructure. Through its participation in GTC 2026, SK hynix plans to demonstrate its competitive edge in Memory technology—the core infrastructure of the AI era.

At the NVIDIA GTC 2026 conference, Samsung comprehensively showcased its technological lineup in the AI computing field, exhibiting a full range of products from high-performance Memory to low-power solutions for personal devices. Samsung unveiled its next-generation HBM4E Memory for the first time. This product achieves a per-pin transfer speed of up to 16Gbps and a bandwidth of up to 4.0 TB/s. Additionally, Samsung demonstrated its Hybrid Copper Bonding (HCB) technology. This new technology will enable next-generation HBM to achieve 16 or more stacked layers while reducing thermal resistance by over 20% compared to thermocompression bonding.

March 16, 2026 (Local Time) — NVIDIA made a major announcement at the 2026 GTC Conference, launching its full-stack AI infrastructure. The core includes three flagship hardware products: the Vera Rubin Platform, Feynman Forward-looking Architecture, and Groq 3 LPU Inference Chip. Simultaneously, it unveiled the NemoClaw Agent Platform and Dynamo AI Factory Operating System, officially declaring that AI has entered a new era of agents and physical AI.

Micron Technology recently announced the completion of its acquisition of the P5 wafer fab from Powerchip Semiconductor Manufacturing Corporation (PSMC) in Tongluo, Miaoli County, Taiwan, China, for a total transaction value of $1.8 billion. The site will serve as a strategic extension of Micron’s large-scale Taichung campus, forming a vertically integrated ecosystem with Micron’s Taichung plant approximately 15 miles away, further strengthening Micron’s industrial presence in the region.

According to South Korean media citing industry sources, Samsung Electronics is collaborating with NVIDIA to accelerate the development of next-generation NAND flash Memory. Researchers from Samsung Electronics' Semiconductor Research Institute, Nvidia, and Georgia Institute of Technology developed a "Physics-Informed Neural Operator (PINO)" model capable of analyzing ferroelectric-based NAND device performance more than 10,000 times faster than conventional methods. The research findings were published to the academic community on the 6th.Based on these results, Samsung is working with NVIDIA to develop and commercialize ferroelectric NAND flash Memory.

Phison's enterprise application brand, PASCARI, has opened a store on the e-commerce platform, with its first listed product being the data center grade SATA SSD SA53P, featuring domestic 3D TLC NAND flash Memory. SA53P adopts a standard 2.5-inch form factor with a 7mm thickness, offering an endurance rating of 1 DWPD. Its sequential read and write speeds reach up to 530 MB/s and 500 MB/s, respectively, while random read and write performance stands at 98K IOPS and 39K IOPS. It also comes with a limited 5-year warranty. Currently, the PASCARI SA53P SSD is available in four capacity versions: 480GB, 960GB, 1920GB, and 3840GB.

On March 10th, MediaTek launched its next-generation Genio smart IoT platform at Embedded World in Nuremberg, Germany. Primarily targeting robotics, commercial drones, and industrial IoT applications, it provides advanced edge AI computing capabilities.

On March 10th, during the Q4 2025 and Full-Year Earnings Call, NIO CEO William Li revealed that the second advanced intelligent chip from its chip subsidiary, Shenji, designed for a wider range of customers, has successfully completed tape-out and is currently in mass production. This new chip will expand beyond NIO's internal application scenarios to external customers in fields such as robotics.

On March 10th, US time, Applied Materials, a global leader in semiconductor manufacturing equipment, announced that Micron and SK Hynix have become founding partners of its EPIC Center in Silicon Valley, jointly advancing the development of next-generation Memory technologies to support the development of AI and high-performance computing industries.