SK Hynix is contemplating a transition to 4F2 or 3D DRAM technology to mitigate the escalating costs associated with Extreme Ultraviolet (EUV) lithography, according to the company's researcher Seo Jae-Wook. The move is considered as EUV costs are becoming prohibitive, especially with the upcoming 1c nm DRAM production.

Samsung Electronics has confirmed plans to introduce DRAM processing equipment at its P4 facility, with full-scale construction underway. The company aims to commence operations in June next year, focusing on the production of the 6th generation 1c process DRAM, which is yet to be commercialized.

SK Hynix's CEO, Lucas Cho, has stated that the Memory chip market will maintain its optimistic outlook for some time, driven by strong demand for high-performance Memory chips like HBM, and is expected to stay active until the beginning of next year.

Kioxia's FY24 Q1 financial report reveals record-high quarterly revenue due to improved supply-demand balance and increased NAND Flash average selling prices, alongside market demand recovery and a weaker yen. Despite significant profit growth, the company has not yet recovered from last year's losses.

Taiwan Semiconductor Manufacturing Company (TSMC) has reported a historic high in its July revenue, setting the stage for a potential new quarterly record in the third quarter of 2024, driven by robust demand in the smartphone and AI sectors for advanced semiconductor processes.

NVM Express, Inc. has announced the release of the NVMe 2.1 specifications, which introduce a suite of new features and updates designed to enhance the performance, security, and development efficiency of NVMe technology in contemporary computing environments. The update includes three new specifications and eight updated ones, further solidifying NVMe's role in unifying various storage solutions.

Kioxia America, Inc. is set to present a cutting-edge broadband solid-state drive (SSD) with an optical interface at the Future of Memory and Storage (FMS) conference. This innovation in SSD technology, developed under the Japanese Next Generation Green Data Center Technology Development Project, promises to elevate data center efficiency and performance while significantly reducing energy consumption.

Server Memory Module DDR4 RDIMM Price Adjustment Announcement

Silicon Motion Technology Corporation, a leading innovator in NAND flash controllers for solid-state storage, has announced the release of the SM2508, the world's first PCIe Gen 5 NVMe 2.0 client SSD controller fabricated using TSMC's 6 nm EUV process. This groundbreaking controller offers a 50% reduction in power consumption over competitive 12 nm process solutions and is specifically designed for AI PCs and gaming consoles, promising to deliver a new standard in power efficiency and performance.

Micron Technology, Inc. announces the development of the industry's first PCIe Gen 6 solid-state drive (SSD) designed to empower the ecosystem and cater to the burgeoning demand for AI. This breakthrough technology, offering sequential read bandwidths exceeding 26 GB/s, is set to accelerate the PCIe Gen 6 ecosystem and solidify Micron's position at the forefront of AI storage solutions.

Kioxia Corporation, a leading storage chip manufacturer, announced on August 1st the completion of its new NAND flash Memory factory, Fab 2 (K2), located in Kitakami City, Iwate Prefecture, Japan. The factory, which began construction in March 2022, is set to commence operations in the fall of 2025. Despite the industry's downturn affecting the construction pace, Kioxia is gearing up for a gradual capital investment in response to market demand recovery.

Lam Research introduces its third-generation cryogenic dielectric etch technology, Lam Cryo? 3.0, which is set to revolutionize the manufacturing process for 1000-layer 3D NAND. With the growing demand for storage with higher capacity and performance driven by the proliferation of generative AI, Lam Cryo 3.0 offers key etching capabilities for the future of cutting-edge 3D NAND. The technology leverages ultra-low temperatures, high-power confined plasma reactor technology, and innovative surface chemistry to achieve etching with industry-leading precision and profile control.

AMD has reported Q2 2024 revenue of $5.8 billion, a 9% increase YoY, with a gross margin of 49% and net income of $265 million. The company's data center business has achieved a record quarterly revenue of $2.8 billion, marking a significant 115% YoY growth, driven by robust sales of the Instinct MI300 GPU and the 4th Gen EPYC CPU. Despite the decrease in semi-custom and embedded business revenue, AMD's AI revenue has surpassed $1 billion, and the company has raised its full-year AI revenue projection to $4.5 billion.

Samsung Electronics is gearing up for the mass production of its fifth-generation High Bandwidth Memory (HBM) chips, the HBM3e, anticipating a significant boost in revenue contribution by year-end.

DapuStor has announced an expansion of its partnership with Marvell, integrating the Flexible Data Placement (FDP) technology, optimized for QLC and TLC NAND SSDs. This collaboration aims to revolutionize the storage industry by addressing the inherent challenges of QLC SSDs, enhancing their performance, endurance, and capacity, providing robust and cost-effective solutions for data centers, cloud computing, and high-performance computing environments.