Kioxia Announces Discontinuation of TSOP-Packaged SLC/MLC Products

Memory giant Kioxia recently notified customers of the discontinuation of its TSOP-packaged products, affecting SLC and MLC memory chips with capacities ranging from 1Gb to 64Gb. The discontinuation is primarily due to the end of the substrate's lifecycle, production constraints, and changes in market demand. With the explosive growth in demand from AI data centers, memory manufacturers are shifting their production capacity towards high-performance QLC technology and enterprise-grade SSDs, gradually marginalizing SLC and MLC due to their lower storage density. Industry analysts believe this move will further exacerbate the supply-demand imbalance for low-capacity MLC (global capacity is projected to shrink by 41.7% by 2026), accelerating the transition to enhanced TLC solutions in industrial control, automotive, and other fields.