The potential specifications of NVIDIA GeForce "Blackwell" series gaming GPUs have been leaked online by Kopite7kimi, a reliable source for NVIDIA leaks. The "Blackwell" series is expected to debut in the fourth quarter of 2024, featuring several GeForce RTX 50-series models based on these chips. The lineup includes five chips, ranging from the flagship GB202 to the entry-level GB207, with the GB202 boasting up to 24,576 CUDA cores and an impressive 1,792 GB/s Memory bandwidth.

At Computex 2024, held from June 4-7 in Taipei, SK hynix demonstrated its latest advancements in AI Memory solutions under the theme "Memory, The Power of AI." The company highlighted its innovative products, including AI server solutions, cutting-edge Memory technologies for on-device AI PCs, and consumer-grade SSDs.

The Korean government has initiated a review of policy support, including tax benefits, for materials, parts, and equipment essential for High Bandwidth Memory (HBM) chip manufacturing. This move aims to bolster the country's semiconductor industry, a critical pillar of its economy.

Samsung Electronics has recently announced that hybrid bonding technology is essential for High Bandwidth Memory (HBM) starting from 16 stacks, marking a significant milestone in semiconductor storage technology. This move is expected to propel the development of high-performance computing and artificial intelligence sectors.

Phison, a leading Memory and storage solutions provider, has projected that its enterprise-grade SSD brand, PASCARI, will constitute 40% of its total revenue by 2026. Launched two weeks ago, PASCARI has already been adopted by American storage clients, with a revenue share of 16% in May and an order share of 25%, showing a rapid increase from 5% in the first quarter. The company's CEO, Pua, Khein-Seng, highlights the brand's three main advantages: unique services not offered by original manufacturers, high inventory flexibility, and competitive pricing. To ensure a stable supply, Phison plans to increase its inventory value to nearly NT$40 billion.

Micron Technology, Inc. has announced the sampling of its cutting-edge GDDR7 graphics Memory, featuring the industry's highest bit density. The new GDDR7 leverages Micron's 1β (1-beta) DRAM technology and an innovative architecture to deliver high-performance Memory at 32 Gb/s within a power-optimized design. Boasting a system bandwidth of over 1.5 TB/s, the GDDR7 offers up to a 60% increase in bandwidth over GDDR6, along with four independent channels for optimized workloads, enabling faster response times and smoother gameplay.

Ryu Byung-hoon, vice president of future strategy at SK hynix, has emphasized the need for cautious investment in High Bandwidth Memory (HBM).

Rubin is likely to use 12-stack HBM4 as its Memory. SK Hynix is planning to start mass production of the Gen 6 HBM in 2025.

Imec and ASML announced the opening of the High NA EUV Lithography Lab in Veldhoven, the Netherlands, a lab jointly run by ASML and imec.

Hanwha Precision Machinery has won a deal with SK Hynix to supply thermal compression (TC) bonders used in the production of high-bandwidth Memory (HBM), TheElec has learned.

The reason China has become the country’s largest export destination again is due to the increase in exports of intermediate goods such as semiconductors to China, which serves as the world's factory amid a favorable global IT market.

PSK Holdings is a supplier of reflow and descum equipment used in HBM production for Samsung and SK Hynix.

Micron CZ120 Memory expansion modules are available for purchase now in production volume through OEM channels.

According to industry sources on May 28, the domestic semiconductor materials company ENF Technology has developed titanium etchant (Ti etchant) using its own technology and has started supplying this material to the world’s largest HBM manufacturer.

As the importance of Extreme Ultraviolet (EUV) lithography equipment, which determines the competitiveness of ultra-fine semiconductor processes, increases, the race to secure next-generation equipment among the top three foundries -- Samsung Electronics, TSMC, and Intel -- is heating up.