According to industry officials on Dec. 18, SK hynix announced at the IEDM 2023, a global semiconductor conference held in the U.S. this month, that it has secured reliability for the Hybrid Bonding process used in HBM manufacturing.

CMM, short for CXL Memory Module, is a Memory specification based on CXL by the international semiconductor standardization organization JEDEC. Inside Samsung, CXL is commonly referred to as CMM.

Samsung Electronics Co. and ASML Holding N.V. have reached a preliminary agreement to build a research and development facility in South Korea with a joint investment of 1 trillion won ($760 million).

DDR5 and LPDDR5/5X CAMM2s cater to distinct use cases. DDR5 CAMM2s are intended for performance notebooks and mainstream desktops, while LPDDR5/5X CAMM2s target a broader range of notebooks and certain server market segments.

According to CFM data, the global NAND Flash market revenue in 3Q23 increased QoQ by7.5% to US$9.81 billion, and the DRAM market increased QoQ by 22.4% to US$13.06 billion.

Samsung Electronics has reportedly incurred costs amounting to about 9 trillion won for chip purchases from global application processor (AP) manufacturers, including Qualcomm and MediaTek.

The flagship company of Korea’s top conglomerate Samsung Group said on Monday the Future Business Planning Division will be led by Jeon Young-hyun, vice chairman of Samsung SDI Co., the group’s battery unit.

The fab equipment maker’s Aegis-3 is its latest equipment that has inspection speed increased by 30% compared to Aegis-2.

According to industry sources on Nov. 26, SK hynix is preparing to integrate 2.5D Fan-out packaging technology into its next generation of DRAM after HBM.

SK Hynix is expected to apply the new PR when it starts expanding the production of 238-layer 3D NAND to coincide with market recovery.

Semiconductor inventories of Samsung Electronics Co. and SK hynix Inc. remained at high levels in the third quarter of this year as the prolonged global economic downturn contracted demand, according to financial reports.

The recovery is attributable to the upturn of the average quarterly price of 8-gigabit DRAM, following a continued decrease since the third quarter of 2021, the ministry said.

Samsung Electronics is developing Low Latency Wide IO (LLW) DRAM, with mass production targeted by the end of next year.

Alibaba's T-Head unit, responsible for the design and development of in-house IC design, has announced the first domestic SSD controller based on the PCIe 5.0 specification standard. Called the Zhenyue 510, the SSD controller is aimed at enterprise SSD offerings.

Western Digital has announced its decision to split its hard disk drive and NAND Memory businesses, creating two separate public companies.