Samsung Electronics announced that it has developed the industry’s first and highest-capacity 32-gigabit (Gb) DDR5 DRAM1 using 12 nanometer (nm)-class process technology.

The new PRO Ultimate lineup features a capacity of up to 512 gigabytes (GB) and a remarkable sequential read speed of up to 200 megabytes-per-second (MB/s).

According to semiconductor industry sources on the 24th, SK hynix’s Wafer Level Package (WLP) division, under their PKG&Test organization, recently decided to reallocate and reinforce their post-processing technological staff as part of their internal Career Growth Program (CGP).

According to CFM data, the global NAND Flash market revenue in 2Q23 increased QoQ by 5% to US$9.13 billion, and the DRAM market increased QoQ by 11.9% to US$10.675 billion; the overall Memory market revenue in 2Q23 was US$19.803 billion, increased 9% QoQ but decrease 54% YoY.

Samsung is aiming to unveil HBM3P, a fifth-generation HBM chip, in the second half of this year and more than double the current HBM production capacity and advanced packaging services next year.

ChinaFlashMarket(CFM) releases the August monthly report, which summarizes the changes of Memory market and important industry events. It is expected that some storage prices may experience new changes in the third quarter.

SK hynix Inc. announced today that it successfully developed HBM3E1, the next-generation of the highest-specification DRAM for AI applications currently available, and said a customer’s evaluation of samples is underway.

SK hynix’s LPDDR5T (Low Power Double Data Rate 5 Turbo) has completed performance verification for application with MediaTek’s next-generation mobile APs.

SK hynix Inc. showcased today the sample of the 321-layer 4D NAND, making public the progress on its development of the industry’s first NAND with more than 300 layers.

NVIDIA today announced the next-generation NVIDIA GH200 Grace Hopper platform - based on a new Grace Hopper Superchip with the world's first HBM3e processor - built for the era of accelerated computing and generative AI.

KIOXIA America, Inc. today announced the addition of the KIOXIA CD8P Series to its lineup of data center-class solid state drives (SSDs).

Micron Technology,today announced sample availability of the Micron CZ120 Memory expansion modules to customers and partners. The Micron CZ120 modules come in 128GB and 256GB capacities in the E3.S 2T form factor, which uses PCIe? Gen5 x8 interface.

However, it will take some time to commercially apply W2W technology due to defect issues.

The hardware from KIOXIA is the first step to putting this working technology in the hands of developers.

The demand for high-performance Memory semiconductors essential for AI chips is experiencing explosive growth due to the escalating demand for AI chips among global tech companies involved in the cloud server business.