Seagate has launched a new FireCuda X1070 SSD on its official website, designed specifically for gaming PCs and handheld consoles. The product adopts the M.2 2280 form factor and supports the PCIe 4.0 x4 interface and NVMe 1.4 protocol. FireCuda X1070 SSD features a DRAM-less low-power storage design, powered by a Tenafe TC2201 controller chip paired with Micron's 232-layers 3D QLC NAND flash Memory. It is available in 1TB, 2TB, and 4TB capacity options.

Silicon Power officially launched its DDR5 RDIMM Memory modules yesterday. The products adhere to JEDEC standards and feature an operating voltage of 1.1V. They are available in single-module capacities of 16GB, 32GB, and 64GB, supporting transfer speeds of 5600MT/s and 6400MT/s. Designed specifically for server and AI computing environments, the Memory modules have passed 24/7 reliability tests, equipped with gold-plated contacts and SPD EEPROM to enhance signal integrity and system compatibility. All models come with a limited lifetime warranty.

Memory giant Kioxia recently notified customers of the discontinuation of its TSOP-packaged products, affecting SLC and MLC Memory chips with capacities ranging from 1Gb to 64Gb. The discontinuation is primarily due to the end of the substrate's lifecycle, production constraints, and changes in market demand. With the explosive growth in demand from AI data centers, Memory manufacturers are shifting their production capacity towards high-performance QLC technology and enterprise-grade SSDs, gradually marginalizing SLC and MLC due to their lower storage density. Industry analysts believe this move will further exacerbate the supply-demand imbalance for low-capacity MLC (global capacity is projected to shrink by 41.7% by 2026), accelerating the transition to enhanced TLC solutions in industrial control, automotive, and other fields.