According to media reports, Winbond Electronics' operational focus this year is primarily on ramping up new product volumes and adjusting production capacity allocation.

Samsung recently established a new HBM development roadmap and has notified its suppliers, requesting them to formulate supply plans by March.

He noted that the current tight supply of Memory is likely to extend until 2027 or even 2028, though the severity of the shortage is not expected to return to levels seen five years ago.

In addition to Microsoft, other major technology companies are also set to adopt low-power DRAM in their AI data centers, heralding new opportunities for the Memory industry.

Samsung Electronics employs a 4nm process for HBM4 logic dies. The chip development and mass production are handled by the System LSI division and the Foundry division within the Device Solutions (DS) business unit. Furthermore, Samsung has been confirmed to be designing logic chips for custom HBM using a 2nm process.

In terms of upstream resources, the prices for 1Tb QLC, 1Tb TLC, 512Gb TLC, and 256Gb TLC have been adjusted to $17.00, $18.00, $15.00, and $9.00 respectively today, while DDR chip prices remain unchanged for now.

Micron expects this acquisition to contribute to meaningful DRAM wafer output beginning in the second half of calendar 2027.

SK hynix Inc. said on Monday that its latest automotive DRAM product, LPDDR5X, has obtained Automotive Safety Integrity Level D (ASIL-D) certification, the highest safety rating under the international automotive functional safety standard ISO 26262.

Due to factors such as the stabilization and recovery of Memory prices, the delivery of key projects, and growth in emerging AI edge-side fields, Biwin achieved significant increases in its Q4 2025 revenue, net profit, and non-GAAP net profit.

Currently, except for a few Memory Manufacturers offering temporary quotes to specific end customers, the market is generally still in the new quarter allocation phase, and the actual price increases for most products have not yet been finalized. Memory Manufacturers continue to maintain a supply-control stance, with new-quarter NAND Wafer allocations and pricing yet to be released. High-grade DRAM resources are accessible only to a very limited number of Memory companies, while most manufacturers have not received supply for several months. Amid continuous price hikes and unstable supply, Memory suppliers are largely accepting orders cautiously based on confirmed demand and agreed prices.

SK Hynix announced on Jan. 13 that it has decided to make a new investment in the advanced packaging fab P&T7 to stably respond to global artificial intelligence (AI) Memory demand and optimize production at the Cheongju fab.”

NVIDIA will establish a research and development (R&D) hub in Korea. This follows up on the commitment made by NVIDIA CEO Jensen Huang, who visited Korea in October last year and announced plans to supply over 260,000 high-performance AI semiconductors.

Micron has announced the launch of the Micron 3610 NVMe™ SSD, the industry's first PCIe® 5.0 QLC SSD designed for client computing.

Kioxia launched the KIOXIA BG7 series SSD, the industry's first client solution incorporating its latest BiCS FLASH™ eighth-generation 3D flash Memory and innovative CMOS directly bonded to array (CBA) technology, designed specifically for PC users.

ADATA: Full-Year 2025 Revenue Reaches NT$53 Billion, Hitting a Record High