Samsung Electronics' memory Semiconductor division has unveiled plans for an organizational restructuring in the second half of the year, signaling a potential breakthrough in core businesses such as High Bandwidth Memory (HBM). The announcement was made during a town hall meeting led by the new head of the Device Solutions (DS) division, emphasizing the importance of synergy and streamlining within the company.

Driven by the global surge in AI technology, Micron Technology is actively expanding its High Bandwidth Memory (HBM) production capabilities worldwide. According to Nikkei Asia, Micron aims to rapidly increase its market share in the HBM sector to approximately 20% by 2025, aligning with its overall revenue share in the DRAM industry.

In the global Semiconductor manufacturing arena, TSMC and Samsung Electronics are the two primary competitors. Despite Samsung Electronics starting mass production of 7nm and 5nm processes later than TSMC, it initially led with the 3nm process. However, this head start did not translate into a customer advantage for Samsung. Insiders have revealed that seven major companies, including Apple, Nvidia, AMD, Intel, Qualcomm, MediaTek, and Google, have chosen TSMC's 3nm process technology over Samsung's.

Intel has entrusted TSMC, the world's leading Semiconductor foundry, with a 3nm process order for the production of its next-generation Core Ultra 200 series processors. This move signifies Intel's strong endorsement of TSMC's advanced manufacturing capabilities and is expected to have a profound impact on the future collaboration between the two companies.

The global Semiconductor industry is on track to set a new sales record in 2024, with the U.S. Semiconductor Industry Association (SIA) reporting a 15.8% year-over-year (YoY) increase and a 1.1% month-over-month (MoM) growth in April 2024, reaching $46.4 billion in sales. The World Semiconductor Trade Statistics (WSTS) forecasts a robust 16.0% growth for 2024 and a continued 12.5% growth in 2025.

The global Semiconductor industry is on track for significant capacity expansion, with the Semiconductor Equipment and Materials International (SEMI) reporting an expected increase of 6% in 2024 and 7% in 2025, setting new records for manufacturing capacity. This surge is primarily driven by the application of artificial intelligence (AI) in data centers and advanced devices, with a projected 13% growth in 5-nanometer and below process technologies in 2024.

Samsung Electronics and SK Hynix are pioneering the integration of 3D DRAM technology with cutting-edge hybrid bonding technology to significantly enhance the performance of memory chips. This innovative approach is expected to revolutionize the field of Semiconductor storage by offering higher data transfer rates and reduced power consumption.

Amidst the AI boom driving a surge in high-speed chip demand, the advanced packaging sector heats up, with Japanese wafer cutting machine giant DISCO projected to reap significant benefits. As chip dimensions approach the atomic scale, advanced packaging, which involves tightly stacking and encapsulating different chips to reduce data transmission time and energy consumption, is becoming a focal point in the Semiconductor supply chain. DISCO, a Semiconductor equipment manufacturer, anticipates a substantial increase in its Q1 profits due to growing demand in the electric vehicle (EV) power Semiconductor and generative AI sectors.

German wafer manufacturing giant Siltronic has officially inaugurated its new wafer production facility in Singapore on June 12, 2024. The facility, located in JTC Tampines Wafer Fab Park, is the largest production base of Siltronic in Singapore, with an investment of €2 billion (approximately S$2.9 billion) and covers an area of 150,000 square meters.

Samsung Electronics is set to revolutionize the high bandwidth memory (HBM) market with the introduction of a 3D packaging service for HBM chips, expected to be utilized in the upcoming HBM4 generation in 2025. This advancement marks a significant step in the evolution of chip packaging technology, with potential implications for the burgeoning AI chip industry.

SK Hynix is fully committed to expanding its 5th generation (1b) 10nm DRAM production to meet the growing demand for next-generation high bandwidth memory (HBM). The company plans to increase its monthly production capacity to 90,000 wafers by the end of this year, a 20,000 wafer increase compared to last year's plan. The industry anticipates that the strong demand for HBM could lead to further expansion of the production increase.

QLC technology allows for the storage of four bits per cell, compared to three bits for TLC, and two and one bit for Multi-Level Cell (MLC) and Single-Level Cell (SLC), respectively. This means QLC NAND can further increase storage capacity compared to other NAND types.

SK hynix claimed that its HBM, manufactured with the company’s unique Mass Reflow-Molded Underfill (MR-MUF) technology, is 60% sturdier than products made using Thermal Compression-Non-Conductive Film (TC-NCF).

World Advanced, a leading wafer foundry, reported a consolidated revenue of NT$3.57 billion in May, marking a 5.37% increase from the previous month and a 13.73% growth compared to the same period last year. This figure is the second-highest monthly revenue of the year, just behind March's performance. The cumulative revenue for the first five months of the year stands at NT$16.592 billion, a 11.38% increase year-on-year.

The Korean government has initiated a review of policy support, including tax benefits, for materials, parts, and equipment essential for High Bandwidth Memory (HBM) chip manufacturing. This move aims to bolster the country's Semiconductor industry, a critical pillar of its economy.