Samsung Electronics has recently announced that hybrid bonding technology is essential for High Bandwidth Memory (HBM) starting from 16 stacks, marking a significant milestone in Semiconductor storage technology. This move is expected to propel the development of high-performance computing and artificial intelligence sectors.

Ryu Byung-hoon, vice president of future strategy at SK hynix, has emphasized the need for cautious investment in High Bandwidth Memory (HBM).

Hanwha Precision Machinery has won a deal with SK Hynix to supply thermal compression (TC) bonders used in the production of high-bandwidth memory (HBM), TheElec has learned.

The reason China has become the country’s largest export destination again is due to the increase in exports of intermediate goods such as Semiconductors to China, which serves as the world's factory amid a favorable global IT market.

PSK Holdings is a supplier of reflow and descum equipment used in HBM production for Samsung and SK Hynix.

According to industry sources on May 28, the domestic Semiconductor materials company ENF Technology has developed titanium etchant (Ti etchant) using its own technology and has started supplying this material to the world’s largest HBM manufacturer.

As the importance of Extreme Ultraviolet (EUV) lithography equipment, which determines the competitiveness of ultra-fine Semiconductor processes, increases, the race to secure next-generation equipment among the top three foundries -- Samsung Electronics, TSMC, and Intel -- is heating up.

SK hynix has announced that the yield (ratio of good chips) of their fifth-generation High Bandwidth Memory (HBM) HBM3E is nearing 80%.

Samsung Electronics today announced that Young Hyun Jun was named as the new Head of Device Solutions (DS) Division to lead the Company’s Semiconductor business and strengthen its competitiveness amid an uncertain global business environment.

Samsung Electronics and SK hynix have significantly increased their research and development (R&D) and facility investments in the first quarter of this year. Samsung Electronics reported its highest first-quarter R&D investment ever.

On May 14, at a European technology symposium held in Amsterdam, the Netherlands, TSMC unveiled details about its sixth-generation HBM4 for the first time. TSMC disclosed that it is considering 12-nanometer (nm) and 5-nm processes for the production of logic dies that will be used in HBM4, effectively offering to customize and supply HBM4 based on client performance requirements.

South Korea is planning to open an AI Semiconductor innovation center in Silicon Valley.

In an impressive display of economic resilience, the Korea Information and Communication Technology (ICT) industry recorded a growth rate in exports over 30% for the first time since March 2022 fueled by strong performances in key segments such as Semiconductors.

Intel Corporation announced the appointment of Kevin O'Buckley as senior vice president and general manager of Foundry Services.

SK hynix Inc. announced today that it recorded 12.43 trillion won in revenues, 2.886 trillion won in operating profit (with an operating margin of 23%), and 1.917 trillion won in net profit (with a net margin of 15%) in the first quarter.