Samsung Electronics has reportedly incurred costs amounting to about 9 trillion won for chip purchases from global application processor (AP) manufacturers, including Qualcomm and MediaTek.

The flagship company of Korea’s top conglomerate Samsung Group said on Monday the Future Business Planning Division will be led by Jeon Young-hyun, vice chairman of Samsung SDI Co., the group’s battery unit.

According to industry sources on Nov. 26, SK hynix is preparing to integrate 2.5D Fan-out packaging technology into its next generation of DRAM after HBM.

SK Hynix is expected to apply the new PR when it starts expanding the production of 238-layer 3D NAND to coincide with market recovery.

Semiconductor inventories of Samsung Electronics Co. and SK hynix Inc. remained at high levels in the third quarter of this year as the prolonged global economic downturn contracted demand, according to financial reports.

The recovery is attributable to the upturn of the average quarterly price of 8-gigabit DRAM, following a continued decrease since the third quarter of 2021, the ministry said.

Samsung Electronics is developing Low Latency Wide IO (LLW) DRAM, with mass production targeted by the end of next year.

The Nov. 1-11 data reinforced expectations South Korea’s Semiconductor exports for all of this month would break the 15-month slump since August of last year on a monthly basis.

SK Hynix Inc. said on Monday it has commercialized the world’s fastest mobile DRAM by shipping its new advanced mobile chips, LPDDR5T, to Chinese smartphone maker Vivo.

The market for the next-generation HBM3E, a high-performance Semiconductor for artificial intelligence within the High Bandwidth Memory (HBM) sector, is heating up. As Samsung Electronics, SK hynix, and Micron all gear up to mass-produce 5th generation HBM3E, the competition is expected to intensify.

The proposed merger between Japan’s Kioxia, a NAND flash memory producer, and the American company Western Digital (WD) has been called off.

Kioxia and its U.S. counterpart Western Digital are reportedly on the verge of finalizing a merger agreement, aiming to create the world's largest producer of memory chips.

Samsung commercialized HBM for high-performance computing (HPC) in 2016 for the first time in the world.

Samsung Electronics and SK hynix received a one-year waiver amid concerns that the move would disrupt their businesses in China, but the latest decision clears uncertainties over their chip production in China, which partly relies on U.S. equipment.

The majority of this inventory consists of the older Double Data Rate (DDR) 4, making it challenging for both companies to quickly reduce their stockpiles.