To proactively address the surging global demand for AI memory, SK Hynix has formulated a medium- to long-term investment strategy totaling 110 trillion won (approximately $71.3 billion).

According to South Korean media reports, Samsung Electronics has detailed its group-wide domestic investment plan valued at 2,655 trillion Korean won. The core of this plan is to expand production bases across the country, with a focus on developing artificial intelligence (AI) semiconductors, robotics, batteries, and IT components and materials. It is reported that Samsung is investing 2,030 trillion won in nurturing semiconductor clusters, including the Pyeongtaek complex and the Yongin National Industrial Complex, and plans to invest 625 trillion won in the Honam, Chungcheong, and Yeongnam regions, with a focus on AI semiconductors, robotics, batteries, and IT components and materials.

Applied Materials has unveiled its product line of three-dimensional (3D) chip manufacturing equipment for AI semiconductors. The series primarily focuses on planarization, deposition, and metrology and inspection required for advanced packaging processes such as high-bandwidth memory (HBM), chiplets, and hybrid bonding. Specifically, the offerings include advanced chemical mechanical polishing (CMP), electrochemical deposition (ECD), and plasma-enhanced chemical vapor deposition (PECVD) equipment for packaging applications, along with newly added electron-beam-based process control tools and enhanced epitaxial equipment for DRAM processes.

According to a report by South Korean media outlet inews24, SK Hynix's U.S. listing process has entered its final sprint. Meanwhile, Kioxia has released a timeline for issuing American Depositary Receipts (ADRs) in the U.S. and plans to implement a stock split to lower the entry barrier for retail investors. The intensive moves by these two industry titans signal that the AI memory supercycle is driving a profound restructuring of global capital markets.

Micron Technology has released its financial results for the third quarter of fiscal 2026, which ended May 28, 2026. This blockbuster earnings report not only beat Wall Street consensus estimates across all key metrics, but also unveiled a transformative long-term business model, signaling that the memory industry is evolving from a traditionally highly cyclical sector into high-value strategic infrastructure for the AI era. Fueled by this positive news, Micron's after-hours stock price once surged by more than 16%.

According to media reports, Samsung Electronics has recently allocated approximately 75,000 wafers to HBM4 production, which is half of its monthly HBM DRAM wafer input volume of 150,000 pieces, while the remaining half is dedicated to fifth-generation HBM3E 12-Hi products. It is said that production of the relatively lower-demand HBM3E 8-Hi products has been temporarily suspended, whose capacity has been shifted to HBM4 manufacturing.

JEDEC has developed and published the SPHBM4 standard. SPHBM4 is a new JEDEC standard that delivers performance close to HBM4 while using fewer signal pins, standard packaging, and more economical substrates. Reduction in signal pins will lead to some performance losses, but SPHBM4 mitigates this by increasing the signal speeds fourfold while reducing the number of signal pins to 1/5th. This leads to HBM-level bandwidth while using standard substrates.

Micron Technology, Inc. announced a strategic agreement with Anthropic that spans memory and storage AI architecture design, supply and demand, enterprise adoption of Claude across Micron and a strategic investment in Anthropic’s Series H funding round. The agreement directly links the demands of frontier AI models to how infrastructure is designed, supplied, and deployed at scale.

SK hynix is putting more weight on targeting the commodity DRAM market while adjusting the pace of expanding mass production of 6th-generation high bandwidth memory (HBM4). With HBM already accounting for more than 40% of revenue and establishing an overwhelming lead, the company says it is reallocating resources to secure additional revenue from commodity DRAM, where the supply shortage is severe, rather than engaging in excessive capacity expansion races.

Samsung Electronics recently held a three-day global strategy meeting. According to industry sources cited by Korean media, the meeting primarily focused on in-depth discussions regarding the expansion of High Bandwidth Memory (HBM) sales and the Long-Term Agreement (LTA) strategy.

According to industry insiders' analysis, Google is developing an upgraded v9 chip, likely codenamed Triggerfish, based on TPU v9 / Humufish, with MediaTek exclusively securing this new, higher-priced order. The key differences between this v9 variant and Humufish are: SRAM capacity is significantly increased to 2–3 times that of Humufish, a new simulation die is added, and memory is upgraded to HBM4E, versus HBM4 on Humufish. With Humufish lifetime shipments still estimated at 4-5 million units, Google is adding an incremental Triggerfish order of 1-2 million units, with production expected to begin in late 2027 and ramp in volume in 2028.

According to South Korean media reports, Samsung is currently collaborating with multiple partners to develop equipment for mass-producing its seventh-generation 10‑nanometer (1d) DRAM, with plans to roll it out in the second or third quarter of next year. Given the time required for actual mass-production preparation, initial volume production of 1d DRAM is expected to commence as early as the end of next year. Samsung's 1d DRAM is anticipated to be used as the core chip for the ninth-generation high-bandwidth memory (HBM5E), which aims to commercialize in 2029.

According to media reports, ASUS launches ET900N G3 workstation，which is already listed at several retailers in the U.S. The price starts from $99,999. ET900N G3 is equipped it with an Nvidia Grace Blackwell Ultra desktop superchip, which features 72 ARM Neoverse V2 processor cores and a Blackwell Ultra graphics chip. The processor is paired with 496 GB of LPDDR5X RAM with a bandwidth of 396 GB/s, while the graphics chip can access 252 GB of HBM3e VRAM with an impressive bandwidth of 7.1 TB/s. The memory pool, which totals 748 GB, can be combined to process larger AI models.

HBM4E is the successor to HBM4 (6th generation), which is currently in mass production. It is expected to be used in NVIDIA's next-generation AI accelerator, "Rubin Ultra," slated for release next year.

According to South Korean media citing SK hynix and fire authorities on the 12th, a fire broke out around 9:55 a.m. (local time) on the second floor of Building M15X, located within SK Hynix's Cheongju plant in Heungdeok District, Cheongju, North Chungcheong Province. After the fire broke out, employees from M15 and M15X were immediately evacuated outdoors. Reports indicate that the company's firefighting team extinguished the fire in its early stages. Cheongju issued a disaster alert, advising nearby residents to avoid the area and vehicles to take detours due to concerns over potential fluoride leaks. According to the latest news, the fire department stated that the investigation found no gas leakage. SK hynix stated that initial control has been completed, and the company is investigating the specific circumstances, adding that production equipment is operating normally. A fire also broke out at SK hynix's Cheongju Site 4 on the 1st of this month.