Samsung Electronics announced it has signed a Memorandum of Understanding (MOU) with AMD to expand their strategic collaboration on next-generation AI memory and computing technologies.Under the MOU, Samsung and AMD will align on primary HBM4 supply for the next-generation AMD AI accelerator, the AMD Instinct MI455X GPU, as well as advanced DRAM solutions for 6th Gen AMD EPYC CPUs, codenamed "Venice". These technologies will support next-generation AI systems combining AMD Instinct GPUs, AMD EPYC CPUs and rack-scale architectures such as the AMD Helios platform. Samsung and AMD will also work together on high-performance DDR5 memory optimized for the 6th Gen AMD EPYC CPUs.

Micron Technology announced financial results for its second quarter of fiscal 2026 (ended February 26, 2026), covering the period from December 2025 to February 2026. Revenue reached $23.86 billion, representing a substantial sequential increase of 75% and a year-over-year surge of 196%. On a non-GAAP basis, operating income was $16.455 billion, with operating margin expanding to 69% from 47% in the prior quarter. Net income reached $14.021 billion, up 156% sequentially and 686% year-over-year.

Kioxia has announced a new category of SSD products, Super High IOPS SSD, which enables the GPU to directly access high-speed flash memory as an expansion to High Bandwidth Memory (HBM) in AI systems. The new Super High IOPS SSD, the KIOXIA GP Series, is purpose-built to meet the growing performance demands of AI and high-performance computing, providing larger GPU-accessible memory capacity for faster data access to AI workloads. Evaluation samples of KIOXIA GP Series will be available to select customers by the end of 2026.

SK hynix memory solutions are designed to minimize data bottlenecks and maximize performance for both AI training and inference in NVIDIA AI infrastructure. Through its participation in GTC 2026, SK hynix plans to demonstrate its competitive edge in memory technology—the core infrastructure of the AI era.

At the NVIDIA GTC 2026 conference, Samsung comprehensively showcased its technological lineup in the AI computing field, exhibiting a full range of products from high-performance memory to low-power solutions for personal devices. Samsung unveiled its next-generation HBM4E memory for the first time. This product achieves a per-pin transfer speed of up to 16Gbps and a bandwidth of up to 4.0 TB/s. Additionally, Samsung demonstrated its Hybrid Copper Bonding (HCB) technology. This new technology will enable next-generation HBM to achieve 16 or more stacked layers while reducing thermal resistance by over 20% compared to thermocompression bonding.

March 16, 2026 (Local Time) — NVIDIA made a major announcement at the 2026 GTC Conference, launching its full-stack AI infrastructure. The core includes three flagship hardware products: the Vera Rubin Platform, Feynman Forward-looking Architecture, and Groq 3 LPU Inference Chip. Simultaneously, it unveiled the NemoClaw Agent Platform and Dynamo AI Factory Operating System, officially declaring that AI has entered a new era of agents and physical AI.

Micron Technology recently announced the completion of its acquisition of the P5 wafer fab from Powerchip Semiconductor Manufacturing Corporation (PSMC) in Tongluo, Miaoli County, Taiwan, China, for a total transaction value of $1.8 billion. The site will serve as a strategic extension of Micron’s large-scale Taichung campus, forming a vertically integrated ecosystem with Micron’s Taichung plant approximately 15 miles away, further strengthening Micron’s industrial presence in the region.

On March 10th, US time, Applied Materials, a global leader in semiconductor manufacturing equipment, announced that Micron and SK Hynix have become founding partners of its EPIC Center in Silicon Valley, jointly advancing the development of next-generation memory technologies to support the development of AI and high-performance computing industries.

Recently, Nvidia CEO Jensen Huang sent a clear signal to DRAM manufacturers at the Morgan Stanley Technology Conference. He stated that the chip supply shortage is "excellent news" for Nvidia, and bluntly told storage manufacturers, "We will use up whatever capacity is added."

Nanya Technology recently disclosed for the first time the progress of its customized AI memory development. The company stated that it is collaborating with multiple logic IC manufacturers and ecosystem partners, and some products have entered the trial production stage. More concrete results are expected to emerge in the second half of this year.

In particular, HBF technology is expected to reduce the total cost of ownership (TCO) while increasing the scalability of AI systems. The industry forecasts that the demand of complex memory solutions, including HBF, will pick up around 2030.

In addition to yield improvements, Samsung Electronics is also significantly increasing its 1c DRAM production capacity.

According to CFM analysis, the global DRAM/NAND Flash market reached $75.51 billion in the fourth quarter of 2025, up 29.2% quarter-over-quarter. The global DRAM market grew 29.8% quarter-over-quarter to $51.97 billion, while the NAND market increased 27.8% quarter-over-quarter to $23.55 billion. For the full year, the global DRAM/NAND Flash market surpassed $200 billion for the first time in history, reaching $221.59 billion, a year-over-year increase of 32.7%.

On February 12, Samsung Electronics announced that it has begun mass production of its industry-leading HBM4 and has shipped commercial products to customers. Samsung’s HBM4 delivers a consistent processing speed of 11.7 gigabits-per-second (Gbps), exceeding the industry standard of 8Gbps by approximately 46% and setting a new benchmark for HBM4 performance. Samsung anticipates that its HBM sales will more than triple in 2026 compared to 2025, and is proactively expanding its HBM4 production capacity. Following the successful launch of HBM4, samples of HBM4E are expected to be released starting in the second half of 2026, while customized HBM samples are scheduled to begin delivery in 2027 according to specific customer specifications.

On February 11(local time), Micron CFO Mark Murphy stated at a semiconductor conference held by Wolfe Research that the company has achieved mass production and commenced customer shipments of HBM4. In response to recent speculation that Micron may be excluded from NVIDIA's HBM4 supply chain, Micron denied expectations that Samsung Electronics and SK Hynix would divide the entire HBM4 supply volume. Murphy further indicated that Micron's HBM4 shipments are steadily increasing in the first quarter of this year, which is one quarter earlier than the timeline projected during the December 2024 earnings call. The company’s entire 2026 HBM production capacity is already sold out. HBM4 production yields are progressing according to plan, while Micron's HBM4 product delivers performance exceeding 11 Gb/s.