SK hynix Reportedly Adopts Intel's EMIB Technology for 2.5D Packaging R&D

According to Korean media ZDNet, citing industry sources, SK hynix is collaborating with Intel on the research and development of 2.5D packaging technology.

It is reported that SK hynix is considering adopting Intel's 2.5D packaging technology, "Embedded Multi-die Interconnect Bridge" (EMIB), and is currently conducting tests to combine HBM and system semiconductors with EMIB-embedded substrates supplied by Intel.

A source said: "Although SK hynix's 2.5D packaging technology is still in the early stages of R&D, they are actively conducting tests to integrate it with Intel's EMIB chips. They are also looking for materials and components suitable for mass production."

Although SK hynix is not currently mass-producing 2.5D packaging directly, considering the structure and characteristics of 2.5D packaging, developing HBM chips is beneficial for improving yield and stability.