Samsung and AMD Signed MOU, Expanding Strategic Collaboration on Next-Generation AI Memory Solutions

Samsung Electronics announced it has signed a Memorandum of Understanding (MOU) with AMD to expand their strategic collaboration on next-generation AI memory and computing technologies.

Under the MOU, Samsung and AMD will align on primary HBM4 supply for the next-generation AMD AI accelerator, the AMD Instinct MI455X GPU, as well as advanced DRAM solutions for 6th Gen AMD EPYC CPUs, codenamed "Venice". These technologies will support next-generation AI systems combining AMD Instinct GPUs, AMD EPYC CPUs and rack-scale architectures such as the AMD Helios platform.

Powered by Samsung HBM4's industry-leading performance, reliability and energy efficiency, the AMD Instinct MI455X GPU is expected to be the optimum solution for high-performance systems handling AI model training and inference. The MI455X GPU will serve as a key building block for the AMD Helios rack-scale architecture, designed to deliver the performance and scalability required for next-generation AI infrastructure.

Samsung and AMD will also work together on high-performance DDR5 memory optimized for the 6th Gen AMD EPYC CPUs. The companies aim to deliver industry-leading DDR5 memory solutions for systems built on the AMD Helios rack-scale architecture.