Kioxia Corporation announced that it has begun mass production of the industry’s first Universal Flash Storage (UFS) Ver. 4.0 embedded flash Memory devices with 4-bit-per-cell, quadruple-level cell (QLC) technology.

From January to September this year, the share of Chinese Mainland in South Korea's Memory export regions dropped to 37.9%, which remained at 40% until May this year, fell to 39% in June, and has continued to decline since then. The proportions for 2022 and 2023 are 51.4% and 44.7%, respectively.

In the DRAM area, SK hynix is continuing the rapid transition from existing HBM3 to 8-layer HBM3E products. The company also plans to start supplying 12-layer HBM3E products, which were mass-produced last month, in the fourth quarter as scheduled. This makes HBM sales, which accounted for 30% of total DRAM revenues in the third quarter, expected to reach 40% in the fourth quarter.

SK Hynix's CEO Kwak Noh-jung recently stated that the company is striving to ship and supply its 12 layer HBM3E as planned, and has given a positive outlook on the demand for artificial intelligence.

Nanya Technology and Kioxia Corporation will jointly introduce vertical transistor DRAM technology using oxide semiconductors, focusing on reducing power consumption and achieving extremely low leakage current.

The latest news is that Apple has announced that all its products will participate in this year's Double 11 event, including the iPhone 16 series, which has only been released for one month.

SK Hynix's robust supply chain and strategic partnerships have positioned the company to exceed market expectations.

In particular, outbound shipments of Memory chips shot up 60.7 percent on-year to $8.7 billion as demand for high-value products, like high-bandwidth Memory chips, increased.

People familiar with the matter said on Thursday that the review, directed by Vice Chairman Jun Young-hyun, the head of the DS division, will lead to significant job cuts at the presidential level.

Micron Technology, Inc. announced results for its fourth quarter and full year of fiscal 2024, which ended August 29, 2024.

SK hynix announced that it has begun mass production of the world’s first 12-layer HBM3E product with 36GB, the largest capacity of existing HBM to date.

JEDEC Solid State Technology Association announced the publication of two new standards supporting Compute Express Link (CXL ) technology. These additions complete a comprehensive family of four standards that provide the industry with unparalleled flexibility to develop a wide range of CXL Memory products.?

The semiconductor industry anticipates full commercialization of CXL in the second half of 2024, coinciding with the release of the first server CPUs featuring the "CXL 2.0" specification. In preparation for this, SK hynix is currently validating CXL 2.0 Memory in 96 GB and 128 GB capacities with customers. The company plans to begin mass production by the end of the year.

Kioxia Holdings Corporation today announced that the company and its subsidiary Kioxia Corporation concluded an agreement of establishment of loan facility of 120 billion yen for capital investment growth purpose with Sumitomo Mitsui Banking Corporation, MUFG Bank, Ltd., and Sumitomo Mitsui Finance and Leasing Company, Limited.

Samsung Electronics is pushing its business with the goal of becoming the number one in the vehicle Memory market by 2025. According to market research firm IHS, Samsung currently holds a 32% market share, ranking second after Micron which holds 44%.