The results significantly exceeded the previous record set in 2024. The annual revenue increased by more than 30 trillion won while the annual operating profit nearly doubled year-on-year, marking the highest annual performance in the company’s history.

Micron broke ground on an advanced wafer fabrication facility located within the company's existing NAND manufacturing complex in Singapore. This new facility represents a planned investment of approximately US $24 billion (SG $31 billion) over 10 years and is designed to ultimately provide 700,000 square feet of cleanroom space.

Samsung recently established a new HBM development roadmap and has notified its suppliers, requesting them to formulate supply plans by March.

Samsung Electronics employs a 4nm process for HBM4 logic dies. The chip development and mass production are handled by the System LSI division and the Foundry division within the Device Solutions (DS) business unit. Furthermore, Samsung has been confirmed to be designing logic chips for custom HBM using a 2nm process.

According to South Korean media reports, informed sources within Samsung Electronics revealed that the yield of Samsung Electronics' 1c DRAM has recently approached 60%. This yield level ensures profitability by exceeding the break-even point.

Currently, the monthly DRAM production capacity based on 12-inch wafers at SK Hynix’s Wuxi plant ranges from 180,000 to 190,000 units, with approximately 90% of this capacity now utilizing the 1a process. The output from the Wuxi plant accounts for 30% to 40% of SK Hynix’s total DRAM production.

SK Hynix announced on Jan. 13 that it has decided to make a new investment in the advanced packaging fab P&T7 to stably respond to global artificial intelligence (AI) memory demand and optimize production at the Cheongju fab.”

NVIDIA will establish a research and development (R&D) hub in Korea. This follows up on the commitment made by NVIDIA CEO Jensen Huang, who visited Korea in October last year and announced plans to supply over 260,000 high-performance AI semiconductors.

SK hynix Inc. announced that it will open a customer exhibition booth at Venetian Expo and showcase its next-generation AI memory solutions at CES 2026, in Las Vegas from January 6 to 9 (local time).

Netlist claims that Samsung Electronics’ core memory products, including High Bandwidth Memory (HBM) and DDR5, have infringed on its technology patents. The company has requested the ITC to issue exclusion orders and cease-and-desist orders to prevent the import of the allegedly infringing products into the United States.

South Korean Media: Samsung to Expand HBM Capacity by Nearly 50% Next Year, Focusing on HBM4

Sources: Samsung Pyeongtaek P4 Fab Construction Accelerated, HBM4 Mass Production Likely to Kick Off Earlier

Behind the $20 Billion Non-Exclusive Deal: NVIDIA Acquires Groq's Core Team to Reduce Reliance on HBM

SK Hynix Advances M15X HBM4 Fab to Feb Launch, Targets NVIDIA Rubin Orders

SK hynix to Deliver 12-Layer HBM4 Final Samples to NVIDIA in Early January 2026