SK hynix Reportedly Breaks Ground on First U.S. Advanced Semiconductor Packaging Plant, Aiming to Produce HBM4E and HBM5

According to South Korean media reports, SK hynix has officially commenced construction on its US semiconductor production base, a project valued at 5.7 trillion won (approximately $3.9 billion). The Indiana fab, SK hynix's first semiconductor plant in the US, has broken ground. Industry insiders reveal that SK Hynix recently notified the local community of the start of piling work, with superstructure construction expected to begin in the second half of this year. The facility is scheduled to commence full production in the second half of 2028, with seventh- and eighth-generation high-bandwidth memory (HBM4E, HBM5) likely to be the main products.