Samsung Reportedly Targets 560+ Layer NAND by 2030, With Over 1,000 Layers to Follow

According to foreign media, Samsung aims to achieve 420-Layer NAND solutions by 2029 and over 560 layers by 2030. Then, at the start of the next decade, Samsung is planning to double this with over 1000-layer solutions. While doubling the layer count introduces challenges such as wafer warpage and inter-layer overlay misalignment, Samsung is reportedly planning to address these issues by introducing the Upper Chuck Design scheme and Overlay Correction technology.