SK Hynix Breaks Ground on P&T7 Advanced Packaging Plant

SK Hynix announced on the 22nd that it held a groundbreaking ceremony for its P&T7 project at the Cheongju Technopark Industrial Complex in South Korea. The project is an advanced packaging plant dedicated to producing AI memory products such as HBM, with an investment of several trillion won. It will be built on a site of approximately 230,000 square meters within the Cheongju Technopark Industrial Complex. The plant will feature a three-story WLP (Wafer-Level Packaging) line with a total area of about 60,000 square meters, and a seven-story WT (Wafer Test) line with a total area of about 90,000 square meters. The cleanroom area alone will reach approximately 150,000 square meters. Following the groundbreaking, construction will commence immediately. The WT line is expected to be completed by October 2027, and the WLP line is expected to be completed by February 2028.