Citing sources familiar with the matter, foreign media reported that major Chinese smartphone makers including Xiaomi, Oppo and Vivo havetold suppliers they will again cut shipment targets for this year, with Xiaomi cutting 30% to ~95M units, as rising costs and unprecedented component shortages continue to weigh heavily on the market.

According to foreign reports, Meta has developed a Memory reuse technology called "Vistara" that breaks through the limitations of existing CXL kits and enables mixed use of multiple Memory types in a single machine. The technology allows DDR4 Memory removed from old servers to be reconnected to new servers, and leverages its self-developed CXL (Compute Express Link) technology to share Memory across different applications while minimizing the additional latency caused by cross-application sharing. It is said that the core design of the Vistara ASIC connects DDR4 Memory to the host processor via a CXL 2.0/1.1-compliant PCIe Gen5 x16 interface. Meta has already deployed this CXL technology across its hyperscale infrastructure, which comprises millions of servers.

To proactively address the surging global demand for AI Memory, SK Hynix has formulated a medium- to long-term investment strategy totaling 110 trillion won (approximately $71.3 billion).

According to South Korean media reports, Samsung Electronics has detailed its group-wide domestic investment plan valued at 2,655 trillion Korean won. The core of this plan is to expand production bases across the country, with a focus on developing artificial intelligence (AI) semiconductors, robotics, batteries, and IT components and materials. It is reported that Samsung is investing 2,030 trillion won in nurturing semiconductor clusters, including the Pyeongtaek complex and the Yongin National Industrial Complex, and plans to invest 625 trillion won in the Honam, Chungcheong, and Yeongnam regions, with a focus on AI semiconductors, robotics, batteries, and IT components and materials.

Applied Materials has unveiled its product line of three-dimensional (3D) chip manufacturing equipment for AI semiconductors. The series primarily focuses on planarization, deposition, and metrology and inspection required for advanced packaging processes such as high-bandwidth Memory (HBM), chiplets, and hybrid bonding. Specifically, the offerings include advanced chemical mechanical polishing (CMP), electrochemical deposition (ECD), and plasma-enhanced chemical vapor deposition (PECVD) equipment for packaging applications, along with newly added electron-beam-based process control tools and enhanced epitaxial equipment for DRAM processes.

According to media reports, in response to the recent market-wide price increases in Memory and other key components that have drawn significant attention, Luca Rossi, Executive Vice President of Lenovo and President of the Intelligent Devices Group (IDG), stated that the company has secured adequate supply. However, he acknowledged that Lenovo cannot be entirely immune to the impact of rising costs, making price increases a continuing challenge. Earlier reports indicated that Lenovo plans to implement a unified price increase across all product categories starting in July, with the magnitude roughly in line with previous adjustments.

If the plan is ultimately finalized, it will mark SK Hynix's first major expansion of NAND capacity at the Cheongju site since the completion of the M15 fab in 2018.

According to a report by South Korean media outlet inews24, SK Hynix's U.S. listing process has entered its final sprint. Meanwhile, Kioxia has released a timeline for issuing American Depositary Receipts (ADRs) in the U.S. and plans to implement a stock split to lower the entry barrier for retail investors. The intensive moves by these two industry titans signal that the AI Memory supercycle is driving a profound restructuring of global capital markets.

Micron Technology has released its financial results for the third quarter of fiscal 2026, which ended May 28, 2026. This blockbuster earnings report not only beat Wall Street consensus estimates across all key metrics, but also unveiled a transformative long-term business model, signaling that the Memory industry is evolving from a traditionally highly cyclical sector into high-value strategic infrastructure for the AI era. Fueled by this positive news, Micron's after-hours stock price once surged by more than 16%.

According to foreign media, Samsung aims to achieve 420-Layer NAND solutions by 2029 and over 560 layers by 2030. Then, at the start of the next decade, Samsung is planning to double this with over 1000-layer solutions. While doubling the layer count introduces challenges such as wafer warpage and inter-layer overlay misalignment, Samsung is reportedly planning to address these issues by introducing the Upper Chuck Design scheme and Overlay Correction technology.

After months of gradual decline, certain wafers have fallen back to their price levels from late January. To reflect the current changes in spot resource trading prices, the prices for 512Gb TLC and 1Tb QLC wafers were adjusted down to $22.50 and $26.50, respectively, today.

JEDEC has developed and published the SPHBM4 standard. SPHBM4 is a new JEDEC standard that delivers performance close to HBM4 while using fewer signal pins, standard packaging, and more economical substrates. Reduction in signal pins will lead to some performance losses, but SPHBM4 mitigates this by increasing the signal speeds fourfold while reducing the number of signal pins to 1/5th. This leads to HBM-level bandwidth while using standard substrates.

Samsung Electronics today announced that, for the first time in the industry, it has developed the industry's fastest Universal Flash Storage (UFS) 5.0 solution. It achieves unparalleled performance levels with the industry's highest bandwidth of up to 10.8 gigabytes per second (GB/s). The new storage solution delivers a sequential read speed of up to 10.8 GB/s and a sequential write speed of up to 9.5 GB/s, speeds that are respectively more than twice as fast as those of the previous UFS 4.1 standard. Samsung UFS 5.0 enables faster storage and processing in mobile Memory while its enhanced power efficiency and smaller package provide optimal mobile AI experiences. Samsung will begin mass production of its UFS 5.0 in the fourth quarter of this year in a variety of capacities up to1TB.

Micron Technology, Inc. announced a strategic agreement with Anthropic that spans Memory and storage AI architecture design, supply and demand, enterprise adoption of Claude across Micron and a strategic investment in Anthropic’s Series H funding round. The agreement directly links the demands of frontier AI models to how infrastructure is designed, supplied, and deployed at scale.

SK hynix is putting more weight on targeting the commodity DRAM market while adjusting the pace of expanding mass production of 6th-generation high bandwidth Memory (HBM4). With HBM already accounting for more than 40% of revenue and establishing an overwhelming lead, the company says it is reallocating resources to secure additional revenue from commodity DRAM, where the supply shortage is severe, rather than engaging in excessive capacity expansion races.