According to South Korean media reports, Samsung Electronics has officially restarted its investment in the NAND flash Memory production line at its P4 plant in Pyeongtaek, with related production equipment beginning to be moved into the plant.

As part of this renewed agreement, Sandisk will pay Kioxia USD 1.165 billion for manufacturing services and continued availability of supply. These cash payments will be made in installments over the years 2026 to 2029.

Well-suited for smartphones and tablets, Kioxia QLC UFS also supports emerging product categories that demand higher capacity and performance, including PCs, networking, AR/VR, IoT, and AI-enabled devices.

Join us on March 27 at the Shenzhen Qianhai JW Marriott Hotel for CFMS｜MemoryS 2026. Under the theme "Transcending Cycles · Unleashing Value" we will convene leading Memory manufacturers, application providers, and ecosystem partners. Together, we will tackle the critical questions: How to fully unleash the potential and commercial value of storage technology? How to break through growth stagnation and forge a highly efficient, new industrial ecosystem for the AI era?

The results significantly exceeded the previous record set in 2024. The annual revenue increased by more than 30 trillion won while the annual operating profit nearly doubled year-on-year, marking the highest annual performance in the company’s history.

In terms of upstream resources, last Friday saw price adjustments for 1Tb QLC, 1Tb TLC, 512Gb TLC, and 256Gb TLC to $19.00, $20.00, $16.00, and $10.00 respectively. This week, the price for DDR5 16Gb eTT was raised to $22, while prices for other DDR5 and DDR4 chips remained unchanged.

Micron broke ground on an advanced wafer fabrication facility located within the company's existing NAND manufacturing complex in Singapore. This new facility represents a planned investment of approximately US $24 billion (SG $31 billion) over 10 years and is designed to ultimately provide 700,000 square feet of cleanroom space.

According to media reports, Winbond Electronics' operational focus this year is primarily on ramping up new product volumes and adjusting production capacity allocation.

Samsung recently established a new HBM development roadmap and has notified its suppliers, requesting them to formulate supply plans by March.

He noted that the current tight supply of Memory is likely to extend until 2027 or even 2028, though the severity of the shortage is not expected to return to levels seen five years ago.

In addition to Microsoft, other major technology companies are also set to adopt low-power DRAM in their AI data centers, heralding new opportunities for the Memory industry.

Samsung Electronics employs a 4nm process for HBM4 logic dies. The chip development and mass production are handled by the System LSI division and the Foundry division within the Device Solutions (DS) business unit. Furthermore, Samsung has been confirmed to be designing logic chips for custom HBM using a 2nm process.

In terms of upstream resources, the prices for 1Tb QLC, 1Tb TLC, 512Gb TLC, and 256Gb TLC have been adjusted to $17.00, $18.00, $15.00, and $9.00 respectively today, while DDR chip prices remain unchanged for now.

Micron expects this acquisition to contribute to meaningful DRAM wafer output beginning in the second half of calendar 2027.

SK hynix Inc. said on Monday that its latest automotive DRAM product, LPDDR5X, has obtained Automotive Safety Integrity Level D (ASIL-D) certification, the highest safety rating under the international automotive functional safety standard ISO 26262.