Winbond Electronics: 8Gb DDR4 Now in Shipment, NOR Flash Wafer Starts to Expand to 30K Units by Mid-Year

According to media reports, Winbond Electronics' operational focus this year is primarily on ramping up new product volumes and adjusting production capacity allocation. As memory supply remains constrained, the shipment momentum for Winbond's Flash and DRAM product lines remains steady, with no signs of cooling demand in the market.

In terms of DRAM, Winbond's 8Gb DDR4 products have begun shipping in the first quarter of this year, with initial applications mainly in televisions, networking, and embedded systems. The introduction of the 8Gb product helps enhance the output value per wafer. In a tight supply environment, customer acceptance of the new specification is high, leading to a significant improvement in the product line structure compared to the past, and the proportion of shipments is expected to gradually increase.

Regarding Flash business, Winbond's NOR Flash wafer starts are set to expand from approximately 25,000 units per month at the end of 2025 to around 30,000 units by mid-2026 to meet demand from industrial control, automotive, and communication applications. As other original manufacturers adjust their product portfolios and reduce related supply, Winbond's position in the NOR Flash market is further strengthened. Additionally, for SLC NAND, market supply has tightened due to the crowding-out effect of overall NAND capacity allocation, leading to simultaneous improvements in both shipment volumes and pricing for Winbond's related products. This serves as another supporting driver for the Flash business.