Samsung Electronics Device Solutions (DS) Memory Business Unit Undergoes Major Executive Reshuffle

Samsung Electronics has announced the completion of its regular 2026 executive personnel adjustments, which included the promotion of 161 executives to positions such as EVP, VP, Fellow, and Master. This represents a significant increase compared to last year's 137 promotions.

Key promotions within the Device Solutions (DS)  Memory Business Unit are as follows:

Silwan Chang, EVP, Head of the Solution Platform Development Team, Memory Business Unit, DS Division
As a software development expert, leveraging experience in server SSD firmware and architecture development, he leads the development of next-generation solution platforms and secures core software and hardware technologies.

Hoin Yoo, VP, DRAM PA2 Group, Memory Business Unit, DS Division
As a DRAM process integration expert, he leads the development of D1c-level DRAM parent products and HBM4, ensuring yield/mass production and controlling high-quality defects to ensure the perfection of DRAM products.

Jaeduk Lee, Fellow, Chief Technology Officer, NAND Flash Technology Development Team, Semiconductor Research Institute, DS Division
As a NAND Flash device expert, he pioneers the development of new devices for high-performance V-NAND products, ensuring product characteristics and cell reliability, thereby enhancing the competitiveness of next-generation V-NAND products.

Heeil Hong, EVP, Head of the DRAM PE Team, Memory Business Unit, DS Division
As a DRAM evaluation/analysis expert, he has ensured the perfection of key DRAM products such as HBM3E/4, high-capacity DDR5, and low-power LPDDR5x through DRAM operation optimization and major defect screening.

Yoon Noh, EVP, Head of the NAND Flash PA1 Group, Memory Business Unit, DS Division
As a NAND process integration expert, he led the introduction of new process schemes to improve cell reliability and ensure mass production, contributing to the development of next-generation V-NAND products.

Byung-hyun Lee, EVP, Head of the DRAM PA2 Group, Memory Business Unit, DS Division
As a DRAM process integration expert, he led the development of D1c-level DRAM parent products and HBM4, enhancing the competitiveness of DRAM products by controlling major high-quality defects and improving device performance.

Jacob Zhu, EVP, Head of the DSC Sales Team for South China, DS Division
As a sales expert in China, leveraging his experience in memory and S.LSI sales, he drives business development in the Chinese market and contributes to expanding the customer base among Chinese companies and maximizing sales.

Yong-deok Jeong, EVP, Head of the MI Technology Team, Global Manufacturing & Infrastructure Department, DS Division
As an expert in semiconductor measurement and defect inspection, he maximizes synergy across all DRAM, NAND Flash, and logic products, overcomes the limitations of measurement technology, and enhances competitiveness in mass production.

Additionally, the following individuals were promoted:

Brian Joung (Head of Memory Marketing) promoted to EVP

Dongjun (Andy) Choi (MI, Head of Part) promoted to VP

Muhyun Seo (DSJ Marketing) promoted to VP

List of Personnel Adjustments in the Samsung Electronics DS Division: