According to South Korean media reports, Samsung Electronics plans to achieve a monthly production capacity of 250,000 HBM wafers by the end of 2026, representing a 47% increase from the current 170,000 wafers per month.
The report cited informed sources as saying that Samsung Electronics has decided to significantly boost its overall HBM production capacity this month and will launch full-scale investments starting from the new year. The investment will include upgrading existing production lines and expanding the new Pyeongtaek Plant 4 (P4) production line. The semiconductor equipment industry expects the large-scale facility investment project to kick off as early as next month.
As the upsurge in AI investment further drives up demand for HBM, Samsung is preemptively securing production capacity to enhance its market responsiveness. Industry insiders speculate that the volume of HBM4 supplied by Samsung Electronics to NVIDIA may exceed initial expectations.
In response, relevant personnel from Samsung Electronics stated that they are evaluating various measures to meet the rapidly growing demand for HBM and cannot confirm specific plans at this time.
