SK hynix to Deliver 12-Layer HBM4 Final Samples to NVIDIA in Early January 2026

According to a report by South Korean media outlet dealsite, SK hynix's HBM4 wafers featuring improved circuits will complete wafer fabrication by the end of this month. The company is set to deliver the final samples of its next-generation 12-layer HBM4 memory to NVIDIA in early January 2026.
Back in September this year, SK hynix supplied the first batch of HBM4 customer samples to NVIDIA. To meet NVIDIA's tight development schedule, SK hynix even adjusted its usual process, skipping the internal Pre-Release Assessment (PRA) and delivering the samples directly.
As a result, certain areas requiring improvements emerged during the subsequent certification process. Speed and reliability issues were exposed in System-in-Package (SiP) testing. Specifically, circuit design modifications are needed to reduce structural constraints while enhancing speed.
Through "tripartite cooperation" with NVIDIA and TSMC—including the sharing of defect data—SK hynix has identified the specific mechanism causing the defects. The report notes that the defects have not significantly impacted process yield, and SK hynix will proceed with the mass production of HBM4 as planned.
If SK hynix can submit more optimized samples in early January next year and quality testing is completed expeditiously, full-scale mass production is expected to commence in February-March, with capacity ramp-up to kick off in the second quarter.
In response to this, SK hynix stated that it declines to comment on customer-related matters.