Samsung Electronics Unveils First HBM5 Chip Model

According to Korean media reports, Samsung Electronics publicly showcased a physical model of its eighth-generation High Bandwidth Memory (HBM5) for the first time at Computex 2026 in Taipei. Song Jae-hyuk, CTO of Samsung Electronics, stated that the biggest difference between HBM4 and HBM5 lies in the process technology of the core chip. HBM4 utilizes the most advanced 1c DRAM, with ongoing improvements in performance, yield, and quality through redesign and process refinement. For HBM5, Samsung is preparing to introduce an advanced 2nm process to optimize the base chip. As seen from the exhibited model, the most notable difference between HBM5 and HBM4E is the adoption of the HPB structure. HPB is a technology designed to address heat dissipation, acting like a physical channel that expels heat to the outside.