Jensen Huang predicts TSMC's production capacity will double in the next decade.

According to Taiwanese media reports, Huang revealed at a "trillion-dollar banquet" in Taipei that NVIDIA is currently in full-scale mass production of its Blackwell and Rubin platforms, creating a huge demand for TSMC wafers and CoWoS packaging. He predicts TSMC's production capacity will double in the next ten years and emphasized that AI development relies on high-end memory. Meanwhile, NVIDIA confirmed it is collaborating with MediaTek to develop low-power, high-AI computing power PC system-on-a-chip, entering the AI ​​PC market.