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SK Hynix to Adopt Hybrid Bonding in Next-Gen NAND Flash, Aiming for 300+ Layers

By: Andy 2025-12-09 10:42 (UTC+0)

According to Korean media reports, SK Hynix will introduce hybrid bonding technology for the first time in its next-generation (V10) NAND flash, with the V10 product expected to reach a stacking level of 300+ layers.

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