JEDEC Previews LPDDR6 Roadmap Expanding LPDDR into Data Centers and Processing-in-Memory

JEDEC previewed a set of new features planned for incorporation into the next version of its JESD209‑6 LPDDR6 standard. It has been working to enhance the next version of the standard to extend LPDDR6 beyond mobile platforms to support selected data center and accelerated computing workloads. Planned features for the upcoming LPDDR6 update include as follows: narrower per-die interface (x6) enabling higher capacities; flexible metadata carve‑out intended to minimize impact to peak data throughput; 512 GB density on the horizon; LPDDR6 SOCAMM2 module standard in development. In addition, JEDEC is also nearing completion of a standard for LPDDR6 Processing‑in‑Memory (LPDDR6 PIM) technology.